JPS59157281A - スパツタリング装置 - Google Patents
スパツタリング装置Info
- Publication number
- JPS59157281A JPS59157281A JP2846883A JP2846883A JPS59157281A JP S59157281 A JPS59157281 A JP S59157281A JP 2846883 A JP2846883 A JP 2846883A JP 2846883 A JP2846883 A JP 2846883A JP S59157281 A JPS59157281 A JP S59157281A
- Authority
- JP
- Japan
- Prior art keywords
- charging
- workpiece
- sputtering
- sputtered film
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 23
- 238000007599 discharging Methods 0.000 abstract 5
- 230000007423 decrease Effects 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 241000555745 Sciuridae Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2846883A JPS59157281A (ja) | 1983-02-24 | 1983-02-24 | スパツタリング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2846883A JPS59157281A (ja) | 1983-02-24 | 1983-02-24 | スパツタリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59157281A true JPS59157281A (ja) | 1984-09-06 |
JPS621472B2 JPS621472B2 (enrdf_load_stackoverflow) | 1987-01-13 |
Family
ID=12249480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2846883A Granted JPS59157281A (ja) | 1983-02-24 | 1983-02-24 | スパツタリング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59157281A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2594102A1 (fr) * | 1986-02-12 | 1987-08-14 | Stein Heurtey | Installation flexible automatisee de traitement thermochimique rapide |
US5021138A (en) * | 1985-01-17 | 1991-06-04 | Babu Suryadevara V | Side source center sink plasma reactor |
US6413381B1 (en) | 2000-04-12 | 2002-07-02 | Steag Hamatech Ag | Horizontal sputtering system |
JP2012512321A (ja) * | 2008-12-15 | 2012-05-31 | ギューリング オッフェネ ハンデルスゲゼルシャフト | 基材コンポーネントの表面処理及び/又はコーティング用の装置 |
CN109468609A (zh) * | 2017-09-07 | 2019-03-15 | 芝浦机械电子装置株式会社 | 成膜装置 |
-
1983
- 1983-02-24 JP JP2846883A patent/JPS59157281A/ja active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021138A (en) * | 1985-01-17 | 1991-06-04 | Babu Suryadevara V | Side source center sink plasma reactor |
FR2594102A1 (fr) * | 1986-02-12 | 1987-08-14 | Stein Heurtey | Installation flexible automatisee de traitement thermochimique rapide |
US4790750A (en) * | 1986-02-12 | 1988-12-13 | Stein Heurtey | Automated flexible installation for a rapid thermochemical treatment |
US6413381B1 (en) | 2000-04-12 | 2002-07-02 | Steag Hamatech Ag | Horizontal sputtering system |
WO2001079582A3 (en) * | 2000-04-12 | 2002-07-04 | Steag Hamatech Ag | Horizontal sputtering system |
JP2012512321A (ja) * | 2008-12-15 | 2012-05-31 | ギューリング オッフェネ ハンデルスゲゼルシャフト | 基材コンポーネントの表面処理及び/又はコーティング用の装置 |
CN109468609A (zh) * | 2017-09-07 | 2019-03-15 | 芝浦机械电子装置株式会社 | 成膜装置 |
US10903059B2 (en) | 2017-09-07 | 2021-01-26 | Shibaura Mechatronics Corporation | Film formation apparatus |
CN109468609B (zh) * | 2017-09-07 | 2021-08-27 | 芝浦机械电子装置株式会社 | 成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS621472B2 (enrdf_load_stackoverflow) | 1987-01-13 |
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