JPS59155995A - 多層配線基板の導体接続法 - Google Patents

多層配線基板の導体接続法

Info

Publication number
JPS59155995A
JPS59155995A JP3167883A JP3167883A JPS59155995A JP S59155995 A JPS59155995 A JP S59155995A JP 3167883 A JP3167883 A JP 3167883A JP 3167883 A JP3167883 A JP 3167883A JP S59155995 A JPS59155995 A JP S59155995A
Authority
JP
Japan
Prior art keywords
conductor
paste
baking
multilayer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3167883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0148672B2 (esLanguage
Inventor
森川　朝男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Togyo KK
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Nippon Tokushu Togyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd, Nippon Tokushu Togyo KK filed Critical NGK Spark Plug Co Ltd
Priority to JP3167883A priority Critical patent/JPS59155995A/ja
Publication of JPS59155995A publication Critical patent/JPS59155995A/ja
Publication of JPH0148672B2 publication Critical patent/JPH0148672B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP3167883A 1983-02-25 1983-02-25 多層配線基板の導体接続法 Granted JPS59155995A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3167883A JPS59155995A (ja) 1983-02-25 1983-02-25 多層配線基板の導体接続法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3167883A JPS59155995A (ja) 1983-02-25 1983-02-25 多層配線基板の導体接続法

Publications (2)

Publication Number Publication Date
JPS59155995A true JPS59155995A (ja) 1984-09-05
JPH0148672B2 JPH0148672B2 (esLanguage) 1989-10-20

Family

ID=12337764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3167883A Granted JPS59155995A (ja) 1983-02-25 1983-02-25 多層配線基板の導体接続法

Country Status (1)

Country Link
JP (1) JPS59155995A (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153893A (ja) * 1986-12-18 1988-06-27 伊勢電子工業株式会社 多層プリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153893A (ja) * 1986-12-18 1988-06-27 伊勢電子工業株式会社 多層プリント配線板

Also Published As

Publication number Publication date
JPH0148672B2 (esLanguage) 1989-10-20

Similar Documents

Publication Publication Date Title
EP0660651B1 (en) Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate
JPWO2007063692A1 (ja) セラミック基板、電子装置およびセラミック基板の製造方法
US6335077B1 (en) Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
JP2001267174A (ja) リード端子付きセラミック電子部品
JPS6342879B2 (esLanguage)
JP4038602B2 (ja) 導電性ペースト及びセラミック多層基板
JPS59155995A (ja) 多層配線基板の導体接続法
JP3167796B2 (ja) セラミックス回路基板
JP2738600B2 (ja) 回路基板
JP2005268672A (ja) 基板
JP3098288B2 (ja) 導体組成物およびそれを用いたセラミック基板
JPH08203769A (ja) セラミック電子部品
JPH0466688B2 (esLanguage)
JP2842711B2 (ja) 回路基板
JP3499061B2 (ja) 多層窒化アルミニウム回路基板
JPS63239999A (ja) セラミツク多層積層体の製造方法
JP2515165B2 (ja) 多層配線基板の製造方法
JPH02260599A (ja) 多層基板の製造法
JPH0620516A (ja) 導体組成物，セラミック多層基板及び半導体装置
JPH0794839A (ja) 回路基板
JP2842710B2 (ja) 回路基板
JPH04369288A (ja) 回路基板
JPH10208970A (ja) 積層セラミックコンデンサ
JPS6381894A (ja) セラミツクス回路基板の製造方法
JPH04369289A (ja) 回路基板