JPS59154098A - Method of producing ceramic through hole printed board - Google Patents
Method of producing ceramic through hole printed boardInfo
- Publication number
- JPS59154098A JPS59154098A JP58027760A JP2776083A JPS59154098A JP S59154098 A JPS59154098 A JP S59154098A JP 58027760 A JP58027760 A JP 58027760A JP 2776083 A JP2776083 A JP 2776083A JP S59154098 A JPS59154098 A JP S59154098A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- manufacturing
- hole
- green sheet
- hole printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野少
本発明は、スルーホール付のセラミックプリント基板の
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of manufacturing a ceramic printed circuit board with through holes.
（従来例の構成とその問題点）
従来、ハイブリッドＩＣはアルミナ基板に銀ペーストな
どで回路をつくり、その上に酸化ルテニウムなどで抵抗
を形成し、その他トランジスタ、ＩＣのチッソ、チップ
コンデンサなどをマウントしている。現在、回路の高密
化、小型化が強く要求され、ハイブリッドＩＣはモノ９
シックなアルミナの多層配線や、アルミナに銀などでス
ルーホールを施しだ両板などのものがある。しかし、前
者のアルミナ多層配線板は、配線の高密化は図れるが機
能回路素子を内蔵することが困難であり、−後者は両面
、すなわち２層以上の多層化が困難である欠点を有して
いた。(Conventional structure and its problems) Conventionally, hybrid ICs have a circuit made of silver paste on an alumina substrate, a resistor made of ruthenium oxide, etc., and other components such as transistors, Nisso IC, and chip capacitors mounted. are doing. Currently, there is a strong demand for higher density and smaller circuits, and hybrid ICs are
There are things like chic alumina multilayer wiring and double-sided alumina boards with through holes made of silver or other material. However, the former alumina multilayer wiring board has the disadvantage that although it can achieve higher wiring density, it is difficult to incorporate functional circuit elements, and the latter has the disadvantage that it is difficult to build double-sided, that is, two or more layers. Ta.
（発明の目的）
本発明の目的は、機能回路素子を実装したセラミ、り回
路板を積層して使用するだめのセラミックスルーホール
シリンド基板の製造方法を提供することである。(Object of the Invention) An object of the present invention is to provide a method for manufacturing a ceramic through-hole cylinder board that is used by laminating ceramic circuit boards mounted with functional circuit elements.
（発明の構成）
本発明は、セラミックグリーンシートに直径０、１ ｍ
ｍ ｐ下で、長さがグリーンシートの厚みと同じ導電線
を埋込み、還元雰囲気中で焼成し、セラミックグリーン
ノートの両面の導体線に金属メッキをするセラミ、クス
ルーホールプリント基板の製造方法である。(Structure of the invention) The present invention provides a ceramic green sheet with a diameter of 0.1 m.
This is a method for manufacturing ceramic, through-hole printed circuit boards in which conductive wires with the same length as the thickness of the green sheet are embedded under mp, fired in a reducing atmosphere, and the conductor wires on both sides of the ceramic green notebook are plated with metal. .
セラミ、りとしてはアルミナを使用し、導体線としては
タングステンを使用し、金属メッキとしては金メッキを
する。Alumina is used as the ceramic material, tungsten is used as the conductor wire, and gold plating is used as the metal plating.
上記したように、セラミ、クグリーンンートｆンートの
厚みと同じ長さで、直径０．１ ｔｒｒｍ以下の導体線
を埋込んだものを還元雰囲気中で焼成すると、グリーン
シートと導体線の収縮率の差によりセラミックグリーン
シートの両面へ、導体線の両端がそれぞれ突出する。As mentioned above, when a ceramic green sheet with the same length as the green sheet and a conductor wire embedded with a diameter of 0.1 trrm or less is fired in a reducing atmosphere, the shrinkage rate of the green sheet and conductor wire is Due to the difference in the distance, both ends of the conductor wire protrude from both sides of the ceramic green sheet.
一方の面の突出した導体線を電極とし、他方の面の突出
した導体線に電気メッキをする。このスルーホール基板
は、予め銀などでスルーホール加工され、両面に回路素
子を実装した２枚のセラミック回路板の所定の接続個所
にはさみこんで、半田付けをすることにより、機能回路
内蔵のセラミック多層配線板を得ることができる。なお
導体が直径０．１ ｗｎ以上ではセラミック焼成の収縮
時にセラミックに亀裂が生ずる恐れがある。The protruding conductor wire on one side is used as an electrode, and the protruding conductor wire on the other side is electroplated. This through-hole board is made by inserting the through-holes into pre-processed ceramic circuit boards with silver, etc., and inserting them into the predetermined connection points of two ceramic circuit boards with circuit elements mounted on both sides and soldering them. A multilayer wiring board can be obtained. Note that if the conductor has a diameter of 0.1 wn or more, there is a risk that cracks will occur in the ceramic during shrinkage during ceramic firing.
（実施例の説明）
本発明の一実施例を第１図ないし第４図に基づいて説明
する。(Description of Embodiment) An embodiment of the present invention will be described based on FIGS. 1 to 4.
第１図に示すように、厚さ１咽のアルミナグリーンシー
ト１（アルミナ純度９８係）に直径０．１祁、長さ１
ｍｍのタングステン線２を埋込む。As shown in FIG.
A tungsten wire 2 of mm is embedded.
次に第２図に示すように１６００℃、窒素と水素の混合
ガス中で焼成するとアルミナは厚さが０８５膿のアルミ
ナ基板３となり、タングステン線２は両面に０．０７５
ｍｍづつ突出する。Next, as shown in Fig. 2, when fired at 1600°C in a mixed gas of nitrogen and hydrogen, the alumina becomes an alumina substrate 3 with a thickness of 0.085 mm, and the tungsten wire 2 has a thickness of 0.07 mm on both sides.
Protrudes by mm.
次に第３図に示すように、一方の突出したタングステン
線２を電極として、他方の面の突出したタングステン線
２に厚さ１０μｍの金の電気メッキ４を施し、同様にし
てタングステン線２の他の面にも金メッキ４をする。Next, as shown in FIG. 3, using the protruding tungsten wire 2 on one side as an electrode, the protruding tungsten wire 2 on the other side is electroplated with gold 4 with a thickness of 10 μm. Gold plate 4 on other surfaces as well.
次に第４図に示すように、このスルーホールアルミナ基
板６を所定の寸法に切断して、アルミナ基板単体５を作
り、この両面に回路素子を実装したアルミナ回路板の銀
スルーホール１１、または銀電極９と位置合わせをし、
半田リフローで接続して機能素子内蔵の積層回路板を得
ることができる。Next, as shown in FIG. 4, this through-hole alumina substrate 6 is cut to a predetermined size to make a single alumina substrate 5, and the silver through-holes 11 of the alumina circuit board with circuit elements mounted on both sides of the alumina substrate 5 are cut. Align with the silver electrode 9,
A laminated circuit board with built-in functional elements can be obtained by connecting with solder reflow.
（発明の効果）
本発明のスルーホールセラミック基板は導体線をスルー
ホールとしているため、従来の印刷によるものよりぐき
わめて微細なスルーホールが得られる。またスルーホー
ルがセラミックの表面から突出しているため、他の回路
板との接続が容易となる。このスルーホール基板を使用
することにより、機能回路が内蔵された多層・セラミ７
７り回路板が信頼性よく容易に作られる効果がある。(Effects of the Invention) Since the through-hole ceramic substrate of the present invention uses conductor wires as through-holes, it is possible to obtain much finer through-holes than those obtained by conventional printing. Also, since the through holes protrude from the ceramic surface, connection with other circuit boards is facilitated. By using this through-hole board, multilayer ceramic 7 with built-in functional circuits can be used.
This has the effect that a circuit board can be manufactured easily and with high reliability.
第１図は本発明の一実施例の製造方法の第１工程を示す
断面図、第２図は同第２工程を示す断面図、第３図は同
第３工程を示す断面図、第４図は本発明によるスルーホ
ール基板の応用例を示す断面図である。
１・・・アルミナグリーンシート、２・・・タングステ
ン線、３・・・アルミナ基板、４・・・金メッキ、５・
・アルミナ基板単体、６・・・アルミナ基板、７・・・
ＩＣ。
８・・・チップコンデンサ、９・・・銀電極、１０・・
・ブレーズ抵抗、１１・・・銀スルーホール。
代 理 人 星 野 恒 司、１．°
・、〜、ご−一一FIG. 1 is a sectional view showing the first step of a manufacturing method according to an embodiment of the present invention, FIG. 2 is a sectional view showing the second step, FIG. 3 is a sectional view showing the third step, and FIG. The figure is a sectional view showing an application example of the through-hole board according to the present invention. 1... Alumina green sheet, 2... Tungsten wire, 3... Alumina substrate, 4... Gold plating, 5...
・Alumina substrate alone, 6... Alumina substrate, 7...
I.C. 8... Chip capacitor, 9... Silver electrode, 10...
- Blaze resistor, 11...silver through hole. Agent Kouji Hoshino, 1. °
・、～、Go-ichiichi
Claims (4)
ｎ ＪＪ下で長さが該グリーンシートの厚みと同じ長さ
の導体線を埋込み、還元雰囲気中で焼成し、セラミック
グリーンシートの両面の導体線を金属メッキすることを
特徴とするセラミ、クスルーホールゾリント基板の製造
方法。(1) Ceramic green sheet with a diameter of 0.1 w
A ceramic, through hole characterized by embedding a conductor wire having the same length as the thickness of the green sheet under JJ, firing in a reducing atmosphere, and plating the conductor wires on both sides of the ceramic green sheet with metal. Method for manufacturing a Zolint substrate.
ることを特徴とする特許□請求の範囲第（１）項記載の
セラミックスルーホールプリント基板の製造方法。(2) A method for manufacturing a ceramic through-hole printed circuit board according to claim (1), wherein the ceramic and green sheets are made of alumina.
する特許請求の範囲第（１）項記載のセラミックスルー
ホールプリント基板の製造方法。(3) The method for manufacturing a ceramic through-hole printed circuit board according to claim (1), wherein the conductor wire is a tungsten wire.
る特許請求の範囲第（１）項記載のセラミックスルーホ
ールプリント基板の製造方法。(4) The method for manufacturing a ceramic through-hole printed circuit board according to claim (1), wherein the metal plating is gold plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58027760A JPS59154098A (en) | 1983-02-23 | 1983-02-23 | Method of producing ceramic through hole printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58027760A JPS59154098A (en) | 1983-02-23 | 1983-02-23 | Method of producing ceramic through hole printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59154098A true JPS59154098A (en) | 1984-09-03 |
Family
ID=12229961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58027760A Pending JPS59154098A (en) | 1983-02-23 | 1983-02-23 | Method of producing ceramic through hole printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154098A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
-
1983
- 1983-02-23 JP JP58027760A patent/JPS59154098A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
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