JPS59151438A - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS59151438A
JPS59151438A JP58024827A JP2482783A JPS59151438A JP S59151438 A JPS59151438 A JP S59151438A JP 58024827 A JP58024827 A JP 58024827A JP 2482783 A JP2482783 A JP 2482783A JP S59151438 A JPS59151438 A JP S59151438A
Authority
JP
Japan
Prior art keywords
light
chip
wire bonder
wire
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58024827A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0245338B2 (enrdf_load_stackoverflow
Inventor
Teruo Arashima
輝雄 荒島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP58024827A priority Critical patent/JPS59151438A/ja
Publication of JPS59151438A publication Critical patent/JPS59151438A/ja
Publication of JPH0245338B2 publication Critical patent/JPH0245338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP58024827A 1983-02-18 1983-02-18 ワイヤボンダ Granted JPS59151438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58024827A JPS59151438A (ja) 1983-02-18 1983-02-18 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58024827A JPS59151438A (ja) 1983-02-18 1983-02-18 ワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS59151438A true JPS59151438A (ja) 1984-08-29
JPH0245338B2 JPH0245338B2 (enrdf_load_stackoverflow) 1990-10-09

Family

ID=12149014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58024827A Granted JPS59151438A (ja) 1983-02-18 1983-02-18 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS59151438A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021025670A (ja) * 2019-07-31 2021-02-22 ダイキン工業株式会社 冷媒サイクル装置
US20220364007A1 (en) * 2019-09-27 2022-11-17 Idemitsu Kosan Co.,Ltd. Lubricating oil composition for refrigerators
JP6908082B2 (ja) * 2019-09-27 2021-07-21 株式会社富士通ゼネラル 冷凍サイクル装置
US20220349633A1 (en) * 2019-10-02 2022-11-03 Mitsubishi Electric Corporation Refrigeration cycle apparatus

Also Published As

Publication number Publication date
JPH0245338B2 (enrdf_load_stackoverflow) 1990-10-09

Similar Documents

Publication Publication Date Title
JP2969401B2 (ja) ボンデイングワイヤ検査装置
US5394246A (en) Bonding wire inspection apparatus and method
JP3299193B2 (ja) バンプ検査方法／装置、情報記憶媒体
JP2969403B2 (ja) ボンデイングワイヤ検査装置
JP2981942B2 (ja) ボンデイングワイヤ検査方法
KR100197178B1 (ko) 본딩 와이어 검사방법
JP2969402B2 (ja) ボンデイングワイヤ検査装置
JPS59151438A (ja) ワイヤボンダ
JP2845601B2 (ja) ワイヤボンディング外観検査装置
JP3812020B2 (ja) 電子部品観察装置及び電子部品観察方法
JPS61124920A (ja) 照明装置
JPS60195405A (ja) 認識装置
JPS62179602A (ja) 部品位置認識方法及び装置
JP2001127080A (ja) ボンダ
JP2862833B2 (ja) 半田付外観検査装置
US6042247A (en) Efficient hybrid illuminator
JPS6351699A (ja) 部品認識装置
JPS5992542A (ja) ボンデイング用照明装置
JP2648975B2 (ja) ワイヤリング検査可能なワイヤボンディング装置
JP3604670B2 (ja) 検査装置及びランプの製造装置
JP4176302B2 (ja) 検査装置
JPH0219969Y2 (enrdf_load_stackoverflow)
JP2752645B2 (ja) 半導体基板のマーク認識装置
JPH11185038A (ja) 画像認識装置
JP2533383B2 (ja) 半導体装置のリ―ド検査装置