JPS59143344A - 電子回路用炭化珪素質基板の製造方法 - Google Patents

電子回路用炭化珪素質基板の製造方法

Info

Publication number
JPS59143344A
JPS59143344A JP58016078A JP1607883A JPS59143344A JP S59143344 A JPS59143344 A JP S59143344A JP 58016078 A JP58016078 A JP 58016078A JP 1607883 A JP1607883 A JP 1607883A JP S59143344 A JPS59143344 A JP S59143344A
Authority
JP
Japan
Prior art keywords
thin plate
silicon carbide
ceramic
substrate
ceramic thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58016078A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131698B2 (enExample
Inventor
Akira Enomoto
亮 榎本
Hidetoshi Yamauchi
山内　英俊
Shoji Tanigawa
庄司 谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP58016078A priority Critical patent/JPS59143344A/ja
Publication of JPS59143344A publication Critical patent/JPS59143344A/ja
Publication of JPH0131698B2 publication Critical patent/JPH0131698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP58016078A 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法 Granted JPS59143344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58016078A JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016078A JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Publications (2)

Publication Number Publication Date
JPS59143344A true JPS59143344A (ja) 1984-08-16
JPH0131698B2 JPH0131698B2 (enExample) 1989-06-27

Family

ID=11906517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016078A Granted JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Country Status (1)

Country Link
JP (1) JPS59143344A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286833A (ja) * 1985-10-14 1987-04-21 Hitachi Ltd セラミック接合方法及びセラミックパッケージの製法及びセラミックパッケージ
JP2010046700A (ja) * 2008-08-22 2010-03-04 Toyota Central R&D Labs Inc 接合体およびその製造方法
KR20220122277A (ko) * 2021-02-26 2022-09-02 해성디에스 주식회사 롤투롤 패널 레벨 패키지

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126413A (en) * 1976-04-16 1977-10-24 Dainippon Toryo Kk Method of sealing ceramics and glass
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52126413A (en) * 1976-04-16 1977-10-24 Dainippon Toryo Kk Method of sealing ceramics and glass
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286833A (ja) * 1985-10-14 1987-04-21 Hitachi Ltd セラミック接合方法及びセラミックパッケージの製法及びセラミックパッケージ
JP2010046700A (ja) * 2008-08-22 2010-03-04 Toyota Central R&D Labs Inc 接合体およびその製造方法
KR20220122277A (ko) * 2021-02-26 2022-09-02 해성디에스 주식회사 롤투롤 패널 레벨 패키지

Also Published As

Publication number Publication date
JPH0131698B2 (enExample) 1989-06-27

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