JPS59129455A - 厚膜混成集積回路板 - Google Patents

厚膜混成集積回路板

Info

Publication number
JPS59129455A
JPS59129455A JP331983A JP331983A JPS59129455A JP S59129455 A JPS59129455 A JP S59129455A JP 331983 A JP331983 A JP 331983A JP 331983 A JP331983 A JP 331983A JP S59129455 A JPS59129455 A JP S59129455A
Authority
JP
Japan
Prior art keywords
layer
resistor
insulating layer
crystallized glass
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP331983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141037B2 (enExample
Inventor
Heikichi Tanei
平吉 種井
Nobuyuki Sugishita
杉下　信行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP331983A priority Critical patent/JPS59129455A/ja
Publication of JPS59129455A publication Critical patent/JPS59129455A/ja
Publication of JPH0141037B2 publication Critical patent/JPH0141037B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP331983A 1983-01-14 1983-01-14 厚膜混成集積回路板 Granted JPS59129455A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP331983A JPS59129455A (ja) 1983-01-14 1983-01-14 厚膜混成集積回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP331983A JPS59129455A (ja) 1983-01-14 1983-01-14 厚膜混成集積回路板

Publications (2)

Publication Number Publication Date
JPS59129455A true JPS59129455A (ja) 1984-07-25
JPH0141037B2 JPH0141037B2 (enExample) 1989-09-01

Family

ID=11554032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP331983A Granted JPS59129455A (ja) 1983-01-14 1983-01-14 厚膜混成集積回路板

Country Status (1)

Country Link
JP (1) JPS59129455A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料

Also Published As

Publication number Publication date
JPH0141037B2 (enExample) 1989-09-01

Similar Documents

Publication Publication Date Title
US4650923A (en) Ceramic article having a high moisture proof
US4835038A (en) Substrate coated with multiple thick films
JP2952303B2 (ja) 複合型回路装置
US6370015B2 (en) Laminated ceramic electronic device
US6436316B2 (en) Conductive paste and printed wiring board using the same
US6338893B1 (en) Conductive paste and ceramic printed circuit substrate using the same
JP2001307547A (ja) 導電性組成物およびそれを用いた印刷回路板
JP3754748B2 (ja) スルーホール充填用導体ペースト、セラミック回路基板及びパッケージ基板
JPS59129455A (ja) 厚膜混成集積回路板
US4927711A (en) Hybrid circuits and thick film dielectrics used therein
JPH09208258A (ja) 絶縁体ガラス組成物とこれを用いた厚膜多層回路絶縁層用ガラス組成物
JPH03134905A (ja) 銅ペースト
JPH04329691A (ja) 導体ぺーストおよび配線基板
JP2968316B2 (ja) 積層型セラミックコンデンサ
JP2842711B2 (ja) 回路基板
JP3631572B2 (ja) 配線基板およびその製造方法
JPS623039A (ja) 絶縁層用材料
JPH04328207A (ja) 導体組成物および配線基板
JPH0216593B2 (enExample)
JPH0578165A (ja) セラミツク基板用組成物
JPH0558201B2 (enExample)
JPH0368485B2 (enExample)
JPS59193096A (ja) 厚膜混成集積回路板
JPS624354A (ja) 厚膜多層基板の製造方法
JPH08148783A (ja) 銅ペーストおよび多層配線基板の製造方法