JPS59126777A - エツチング液の能力維持管理法および装置 - Google Patents
エツチング液の能力維持管理法および装置Info
- Publication number
- JPS59126777A JPS59126777A JP23220482A JP23220482A JPS59126777A JP S59126777 A JPS59126777 A JP S59126777A JP 23220482 A JP23220482 A JP 23220482A JP 23220482 A JP23220482 A JP 23220482A JP S59126777 A JPS59126777 A JP S59126777A
- Authority
- JP
- Japan
- Prior art keywords
- hydrochloric acid
- etching solution
- etching
- hydrogen peroxide
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 78
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 14
- 238000009499 grossing Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 27
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 7
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 7
- 229940045803 cuprous chloride Drugs 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23220482A JPS59126777A (ja) | 1982-12-31 | 1982-12-31 | エツチング液の能力維持管理法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23220482A JPS59126777A (ja) | 1982-12-31 | 1982-12-31 | エツチング液の能力維持管理法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59126777A true JPS59126777A (ja) | 1984-07-21 |
| JPH0245713B2 JPH0245713B2 (enrdf_load_stackoverflow) | 1990-10-11 |
Family
ID=16935614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23220482A Granted JPS59126777A (ja) | 1982-12-31 | 1982-12-31 | エツチング液の能力維持管理法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59126777A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241189A (ja) * | 1987-03-27 | 1988-10-06 | Yamatoya Shokai:Kk | エツチング液の能力維持管理法 |
| JPH08269747A (ja) * | 1995-03-31 | 1996-10-15 | Nippon Aqua Kk | エッチング液の再生方法およびエッチング液 |
| KR100313632B1 (ko) * | 1997-09-22 | 2002-01-17 | 모리시타 요이찌 | 에칭장치및에칭방법및그방법에의해작성된배선기판 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536267A (en) * | 1978-09-08 | 1980-03-13 | Mitsubishi Heavy Ind Ltd | Production of phosphate pigment |
-
1982
- 1982-12-31 JP JP23220482A patent/JPS59126777A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5536267A (en) * | 1978-09-08 | 1980-03-13 | Mitsubishi Heavy Ind Ltd | Production of phosphate pigment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241189A (ja) * | 1987-03-27 | 1988-10-06 | Yamatoya Shokai:Kk | エツチング液の能力維持管理法 |
| JPH08269747A (ja) * | 1995-03-31 | 1996-10-15 | Nippon Aqua Kk | エッチング液の再生方法およびエッチング液 |
| KR100313632B1 (ko) * | 1997-09-22 | 2002-01-17 | 모리시타 요이찌 | 에칭장치및에칭방법및그방법에의해작성된배선기판 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0245713B2 (enrdf_load_stackoverflow) | 1990-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3964956A (en) | System for maintaining uniform copper etching efficiency | |
| US3705061A (en) | Continuous redox process for dissolving copper | |
| US4269678A (en) | Method for regenerating a cupric chloride and/or ferric chloride containing etching solution in an electrolysis cell | |
| JP2010533242A (ja) | 銅のエッチングおよび使用済みエッチング溶液の回収のための方法 | |
| JP5214996B2 (ja) | エッチング方法 | |
| US3341384A (en) | Dissolution of metal with acidified hydrogen peroxide containing dibasic acid | |
| US4806192A (en) | Method for etching materials | |
| JPH09502483A (ja) | 銅エッチング剤溶液添加物 | |
| JPS6363633B2 (enrdf_load_stackoverflow) | ||
| JPS59126777A (ja) | エツチング液の能力維持管理法および装置 | |
| CA2029444A1 (en) | System and process for etching with and regenerating, alkaline ammoniacal etchant solution | |
| KR101999871B1 (ko) | 패턴화된 기재를 연속 습식 에칭하는 방법 | |
| JP2732623B2 (ja) | エッチング方法 | |
| CA2069933C (en) | Etching solution containing a vanadium catalyst | |
| US4343892A (en) | Method and apparatus for silver recovery during photographic processing | |
| JPS6247951B2 (enrdf_load_stackoverflow) | ||
| JPH0633268A (ja) | 銅及び銅合金の表面処理方法 | |
| JP4210382B2 (ja) | 薄銅箔用エッチング液および薄銅箔エッチング方法 | |
| JPH0158270B2 (enrdf_load_stackoverflow) | ||
| JPH06146022A (ja) | エッチング処理装置 | |
| JP3320111B2 (ja) | エッチング方法 | |
| JPS59222583A (ja) | 銅または銅合金用エツチング液のエツチング能力再生方法 | |
| Kao et al. | Etch profile development in spray etching processes | |
| JP3809608B2 (ja) | 無電解銅めっき方法とその装置及びその銅補給液の作製方法とその装置 | |
| JP2962510B2 (ja) | 銅および銅合金のエッチング方法 |