JPH0245713B2 - - Google Patents

Info

Publication number
JPH0245713B2
JPH0245713B2 JP57232204A JP23220482A JPH0245713B2 JP H0245713 B2 JPH0245713 B2 JP H0245713B2 JP 57232204 A JP57232204 A JP 57232204A JP 23220482 A JP23220482 A JP 23220482A JP H0245713 B2 JPH0245713 B2 JP H0245713B2
Authority
JP
Japan
Prior art keywords
hydrochloric acid
etching solution
hydrogen peroxide
etching
acid concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57232204A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59126777A (ja
Inventor
Kunio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamatoya and Co Ltd
Original Assignee
Yamatoya and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatoya and Co Ltd filed Critical Yamatoya and Co Ltd
Priority to JP23220482A priority Critical patent/JPS59126777A/ja
Publication of JPS59126777A publication Critical patent/JPS59126777A/ja
Publication of JPH0245713B2 publication Critical patent/JPH0245713B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP23220482A 1982-12-31 1982-12-31 エツチング液の能力維持管理法および装置 Granted JPS59126777A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23220482A JPS59126777A (ja) 1982-12-31 1982-12-31 エツチング液の能力維持管理法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23220482A JPS59126777A (ja) 1982-12-31 1982-12-31 エツチング液の能力維持管理法および装置

Publications (2)

Publication Number Publication Date
JPS59126777A JPS59126777A (ja) 1984-07-21
JPH0245713B2 true JPH0245713B2 (enrdf_load_stackoverflow) 1990-10-11

Family

ID=16935614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23220482A Granted JPS59126777A (ja) 1982-12-31 1982-12-31 エツチング液の能力維持管理法および装置

Country Status (1)

Country Link
JP (1) JPS59126777A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780092B2 (ja) * 1987-03-27 1998-07-23 株式会社 ヤマトヤ商会 エツチング液の能力維持管理法
JP3597250B2 (ja) * 1995-03-31 2004-12-02 日本アクア株式会社 エッチング液の再生方法およびエッチング液再生装置
JPH1192966A (ja) * 1997-09-22 1999-04-06 Matsushita Electric Ind Co Ltd エッチング液濃度制御装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536267A (en) * 1978-09-08 1980-03-13 Mitsubishi Heavy Ind Ltd Production of phosphate pigment

Also Published As

Publication number Publication date
JPS59126777A (ja) 1984-07-21

Similar Documents

Publication Publication Date Title
US3705061A (en) Continuous redox process for dissolving copper
US4545877A (en) Method and apparatus for etching copper
EP2165007B1 (en) A method for etching copper and recovery of the spent etching solution
US4269678A (en) Method for regenerating a cupric chloride and/or ferric chloride containing etching solution in an electrolysis cell
US20150361341A1 (en) High-efficiency High-quality and Safe Alkaline Cupric Chloride Etchant for Printed Circuit Board
JP5604307B2 (ja) 銅または銅合金用のエッチング液、エッチング方法及びエッチング液の再生管理方法
US4772365A (en) Method for etching materials
JP2009203493A (ja) エッチング方法およびエッチング液の再生方法
US4329210A (en) Method of regenerating etchant and recovering etched metal
JPS6199683A (ja) 塩化銅エッチング溶液の再生方法
JPH0245713B2 (enrdf_load_stackoverflow)
US3837945A (en) Process of etching copper circuits with alkaline persulfate and compositions therefor
JP3431931B2 (ja) 銅及び銅合金の表面処理方法
JPH0158270B2 (enrdf_load_stackoverflow)
EP0448870A1 (en) System and process for etching with, and regenerating, alkaline ammoniacal etchant solution
JP4210382B2 (ja) 薄銅箔用エッチング液および薄銅箔エッチング方法
JPS6247951B2 (enrdf_load_stackoverflow)
JP3320111B2 (ja) エッチング方法
US3919100A (en) Alkaline etchant compositions
JP3193152B2 (ja) 金属のエッチング方法
JP2962510B2 (ja) 銅および銅合金のエッチング方法
JPH11256368A (ja) 薄銅箔用のエッチング液および薄銅箔のエッチング方法
Kao et al. Etch profile development in spray etching processes
JPS63241189A (ja) エツチング液の能力維持管理法
JP2745195B2 (ja) プリント配線板のエッチング装置