JPS59121858A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59121858A
JPS59121858A JP57227614A JP22761482A JPS59121858A JP S59121858 A JPS59121858 A JP S59121858A JP 57227614 A JP57227614 A JP 57227614A JP 22761482 A JP22761482 A JP 22761482A JP S59121858 A JPS59121858 A JP S59121858A
Authority
JP
Japan
Prior art keywords
cap
base
package
glass
vicinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57227614A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340950B2 (enExample
Inventor
Takeshi Takenaka
竹中　武
Kaoru Tachibana
薫 立花
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57227614A priority Critical patent/JPS59121858A/ja
Publication of JPS59121858A publication Critical patent/JPS59121858A/ja
Publication of JPH0340950B2 publication Critical patent/JPH0340950B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57227614A 1982-12-28 1982-12-28 半導体装置 Granted JPS59121858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57227614A JPS59121858A (ja) 1982-12-28 1982-12-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57227614A JPS59121858A (ja) 1982-12-28 1982-12-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS59121858A true JPS59121858A (ja) 1984-07-14
JPH0340950B2 JPH0340950B2 (enExample) 1991-06-20

Family

ID=16863691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57227614A Granted JPS59121858A (ja) 1982-12-28 1982-12-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS59121858A (enExample)

Also Published As

Publication number Publication date
JPH0340950B2 (enExample) 1991-06-20

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