JPS59121851A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS59121851A
JPS59121851A JP57227297A JP22729782A JPS59121851A JP S59121851 A JPS59121851 A JP S59121851A JP 57227297 A JP57227297 A JP 57227297A JP 22729782 A JP22729782 A JP 22729782A JP S59121851 A JPS59121851 A JP S59121851A
Authority
JP
Japan
Prior art keywords
hole
grid line
metal
forming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57227297A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342505B2 (cg-RX-API-DMAC10.html
Inventor
Yoshio Umemura
梅村　佳男
Yasushi Matsumi
松見　康司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP57227297A priority Critical patent/JPS59121851A/ja
Publication of JPS59121851A publication Critical patent/JPS59121851A/ja
Publication of JPH0342505B2 publication Critical patent/JPH0342505B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P54/00—

Landscapes

  • Dicing (AREA)
JP57227297A 1982-12-28 1982-12-28 半導体装置の製造方法 Granted JPS59121851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57227297A JPS59121851A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57227297A JPS59121851A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59121851A true JPS59121851A (ja) 1984-07-14
JPH0342505B2 JPH0342505B2 (cg-RX-API-DMAC10.html) 1991-06-27

Family

ID=16858602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57227297A Granted JPS59121851A (ja) 1982-12-28 1982-12-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59121851A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129855A (ja) * 1989-10-16 1991-06-03 Sanyo Electric Co Ltd 半導体装置の製造方法
JPH0438053U (cg-RX-API-DMAC10.html) * 1990-07-26 1992-03-31
JP2009239149A (ja) * 2008-03-28 2009-10-15 Nec Electronics Corp 半導体ウエハ、半導体チップ、半導体装置、及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5779646A (en) * 1980-11-05 1982-05-18 Nec Corp Semiconductor wafer
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5779646A (en) * 1980-11-05 1982-05-18 Nec Corp Semiconductor wafer
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129855A (ja) * 1989-10-16 1991-06-03 Sanyo Electric Co Ltd 半導体装置の製造方法
JPH0438053U (cg-RX-API-DMAC10.html) * 1990-07-26 1992-03-31
JP2009239149A (ja) * 2008-03-28 2009-10-15 Nec Electronics Corp 半導体ウエハ、半導体チップ、半導体装置、及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0342505B2 (cg-RX-API-DMAC10.html) 1991-06-27

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