JPS59119797A - 多層配線基板 - Google Patents
多層配線基板Info
- Publication number
- JPS59119797A JPS59119797A JP23117582A JP23117582A JPS59119797A JP S59119797 A JPS59119797 A JP S59119797A JP 23117582 A JP23117582 A JP 23117582A JP 23117582 A JP23117582 A JP 23117582A JP S59119797 A JPS59119797 A JP S59119797A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ground layer
- signal
- multilayer wiring
- signal line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005516 engineering process Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 5
- 229920000620 organic polymer Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23117582A JPS59119797A (ja) | 1982-12-25 | 1982-12-25 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23117582A JPS59119797A (ja) | 1982-12-25 | 1982-12-25 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59119797A true JPS59119797A (ja) | 1984-07-11 |
| JPH0365674B2 JPH0365674B2 (enrdf_load_stackoverflow) | 1991-10-14 |
Family
ID=16919488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23117582A Granted JPS59119797A (ja) | 1982-12-25 | 1982-12-25 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119797A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102766U (enrdf_load_stackoverflow) * | 1990-02-08 | 1991-10-25 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138162U (enrdf_load_stackoverflow) * | 1977-04-08 | 1978-11-01 | ||
| JPS5416284U (enrdf_load_stackoverflow) * | 1977-07-04 | 1979-02-02 | ||
| JPS55108797A (en) * | 1979-02-13 | 1980-08-21 | Hitachi Ltd | Circuit board |
-
1982
- 1982-12-25 JP JP23117582A patent/JPS59119797A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138162U (enrdf_load_stackoverflow) * | 1977-04-08 | 1978-11-01 | ||
| JPS5416284U (enrdf_load_stackoverflow) * | 1977-07-04 | 1979-02-02 | ||
| JPS55108797A (en) * | 1979-02-13 | 1980-08-21 | Hitachi Ltd | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102766U (enrdf_load_stackoverflow) * | 1990-02-08 | 1991-10-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365674B2 (enrdf_load_stackoverflow) | 1991-10-14 |
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