JPS59117289A - Universal printed circuit board and method of producing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a universal printed wiring board and a method for manufacturing the same, and more particularly to a printed wiring board in which a desired circuit pattern is formed by selectively separating conductive patterns provided in a lattice shape on the surface of the board. It's a thing.

Conventionally, the conductive pattern on the surface of a printed wiring board is as shown in Figure 1 (
5) As shown in (B), individual patterns 1 are drawn on the grid lines connecting to the circular patterns provided at the intersections of the grid.
Printed wiring boards provided by the arrangements of and two have been provided. For this reason, each printed wiring board requires an original drawing with a pattern arranged one by one.

On the other hand, in recent years, the production system for printed wiring boards has increasingly tended toward high-mix, low-volume production, and the manufacturing cost of the printed wiring boards themselves and the cost of creating original images associated therewith have become relatively high. Furthermore, each time a revision is made due to a change in the circuit pattern of one part, a new original image must be created.

Therefore, the manufacturing process of printed wiring boards has disadvantages such as small-lot production of products with individual circuit patterns from beginning to end, and an increase in production control man-hours.

An object of the present invention is to provide a printed wiring board that eliminates such conventional drawbacks.

That is, according to the present invention, the ? A process of arranging conductive patterns of different shapes along the virtual grid lines on the surface of a printed wiring board and an insulating substrate, characterized in that conductive patterns of different shapes are arranged along the virtual grid lines on the surface of the three-edge substrate; , there is obtained a method for manufacturing a printed wiring board, which is characterized in that it includes a step of selectively separating the conductive pattern, and further characterized in that the different shapes are a combination of a circle and a straight line width. .

Embodiments of the present invention will be described below with reference to FIGS. 2 to 4.

FIG. 2 shows the arrangement of a mesh-like circuit pattern 3 of the present invention in which individual circuit patterns 1 and 2 in the Y-axis and X-axis directions of a four-electroconductivity pattern are arranged one over the other in a grid pattern.

FIGS. 3(5) and 3(B) show an arrangement in which holes are formed in the mesh pattern 3 described above and desired individual circuit patterns 4 and 5 are selectively separated.

First, as shown in FIG. 2, a circuit pattern 3 is formed on a catalyst-filled insulating substrate or a substrate having a metal layer on its surface by an additive method. Next, as shown in FIGS. 3(G) and CB), a hole is drilled into a part of the circuit pattern 3 using a drill 9 that is larger than the width t of the circuit pattern 3 and has a diameter that does not penetrate into the area of the seat 6. is cut to form a non-conductive part 7.

This non-conductive portion 7 is a through hole or a non-through hole. In the case of a non-through hole, as shown in FIG. 4, the descending distance (h) of the drill 9 is controlled to produce circuit pattern 8f on the back side: printed wiring on both sides or one side with the desired circuit pattern placed without cutting. Form a board. FIG. 5 shows the second embodiment of the present invention.
In this embodiment, the same mesh-like circuit pattern 3t as in the first embodiment - the conductor layer (width and thickness) of the circuit pattern at a predetermined position is cut by an automatically controlled cutter (not shown). Then, a pattern removal section is provided.

As described above, the present invention has the following effects.

(1) There is no need to use a large number of original images.

(11) Production control man-hours are reduced.

(iii) Lead type can be shortened.

(1v) It is possible to form a double-sided or single-sided printed wiring board with a desired pattern arrangement.

Note that the scope of application of the present invention is not limited to this, and does not preclude other applications in any way.

[Brief explanation of drawings]

FIGS. 1(5) and (B) are partially enlarged views of the individual pattern arrangement surface of a conventional printed wiring board; FIG. 2 is a partially enlarged view of the mesh pattern arrangement surface of the printed wiring board according to an embodiment of the present invention; Third
Figures (5) and (B) are partially enlarged views of the pattern arrangement surface after selection and separation of the printed wiring board in Figure 2, and Figure 4 is an enlarged cross-sectional view of the printed wiring board in the selection and separation state of Figure 3. , FIG. 5 is a partially enlarged view of the pattern arrangement surface after selection and separation of the printed wiring board of FIG. 2 according to another embodiment of the present invention. [Symbols in the diagram] 1.2, 4.5...Individual circuit pattern, 3...
・Mesh-like) circuit pattern, 6... seat, 7.
...Non-conductive part, 8...Circuit pattern on back side, 9...Do IJ JPet...Width of mesh-like circuit pattern, h.・・・・・・Distance the drill will descend. -42; Figure 3 (A) l Figure 3 (5) Evening map

Claims (3)

[Claims] (1) A printed wiring board characterized by having conductive patterns of different shapes arranged along virtual grid lines on the surface of an insulating substrate. (2) A method for manufacturing a printed wiring board, comprising the steps of arranging conductive patterns of different shapes along virtual grid lines on the surface of an insulating substrate, and selectively separating the conductive patterns. . (3) The component wiring board according to claim 1, wherein the different shapes are a combination of a circle and a straight line width.