JPS6043893A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention is a method for manufacturing a printed wiring board. Traditionally, printed wiring boards are conductive.

After drilling t rows 7t-z 7, resist formation of the desired pattern in locations other than the hole portions and pad portions, and two lines of Ouchi conductor formation were performed. However, this method has the disadvantage that when resist formation occurs during resist formation, the large circle is contaminated with resist, or the resist is covered over the hole, making it difficult to form the inner conductor. 7r.

The present invention is as follows: 7i: In view of point VC, hole drilling, resist formation of Qt desired pattern of i', 41 hf except for hole and bad capital, surface surrounding circuit formation, Ouchi conductor In the method of manufacturing a printed wiring board by forming a resist, an opening is carried out after one line of forming a resist for an FJTWi pattern. hand,
(a) Copper-clad laminate (1) Etching resist formed on the surface area, etching resist formed on the body circuit (2) L formed, (b) Resist that also served as an under resist on the parts other than through-hole capitals and land areas. (6) forming the holes, (C) drilling the holes (4), and (d) forming the through holes and land portions [41; 5] by electroless plating.

In the second step, (a) a resist (5) is formed on a desired portion of the surface of the opposing substrate (7) (6), and (b) eight (4)
After the plating process, (C) form the surface circuit part, through ball, and land part VC conductor (5) by electroless plating, and (c)
Peel the resist carefully (optional), (e
)←Solder resist) (8) Forming a resist (6) f In Figure 6, (a) Form a resist (6) f on the surface of the thin copper foil (a) b) With hole (4) τ without % (C) Conductor (5), (8) τ in the next curved circuit part, through hole, and land part by continuous plating and electroplating
(d) resist stripping and (e) soft etching.

In Fig. 4, (a) H1 pattern resist (6) is formed on the surface of the dense OQ substrate, (b) (4) opening is done, (C) is being done in a seeder place, ( d) Peel off the resist r, and (e) form conductors (5) in the surface circuit area, through holes, and land areas by electroless plating.

As explained above, in VC non-invention, is there a problem common to registry fL? Solve C, resist J'1'Valley's n
%1 (no tolerance for resist and holes in 7J)
When the negative L is 1.01 mm in hole diameter and 1.2 mm in land diameter, it becomes iJ, 5 nun from the current 0.1 capacity.

[Brief explanation of drawings]

The 1st to 4th kyou are the raiko kyou that represent the sword of fuzu 6 ming. Explanation of symbols 1.Crystalline layer board 2. Conductor circuit 6. Resist 4. Enter 5. Conductor 6, 3≧F *A 7. Board 8. Ruder resist 9. Electric drilling @ conductor circuit 1o, e green board Figure 3 Figure 4 Continuation of page 1 0 shots Akira Yamano Ii Kiyoshi, Shimodate City, Oaza, premises

Claims (1)

[Claims] 1. A method for manufacturing a printed wiring board, which includes forming holes, forming a resist with a desired pattern on the entry and pad portions, forming a dedicated circuit on the surface, and forming an internal conductor, A method for manufacturing a printed wiring board, which includes forming a resist with a desired pattern and then performing a spacing. 2. A method for manufacturing a printed wiring board according to claim 1(a), which is carried out using a special in-house forming method. 3. Surface conductor i! 21. The method of manufacturing a printed wiring board according to claim 1, which is carried out by forming a copper clad layer and etching it. 4. A method for producing a 6-layer printed thin strip board as claimed in claim 1, wherein the resist of the desired FA pattern also serves as a solder resist.