JPS59113972A - 半田球供給装置 - Google Patents

半田球供給装置

Info

Publication number
JPS59113972A
JPS59113972A JP22075583A JP22075583A JPS59113972A JP S59113972 A JPS59113972 A JP S59113972A JP 22075583 A JP22075583 A JP 22075583A JP 22075583 A JP22075583 A JP 22075583A JP S59113972 A JPS59113972 A JP S59113972A
Authority
JP
Japan
Prior art keywords
ball
solder
tank
liquid level
gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22075583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6313788B2 (show.php
Inventor
Hitosuke Matsuo
松尾 仁介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MATSUO HANDA KK
Original Assignee
MATSUO HANDA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MATSUO HANDA KK filed Critical MATSUO HANDA KK
Priority to JP22075583A priority Critical patent/JPS59113972A/ja
Publication of JPS59113972A publication Critical patent/JPS59113972A/ja
Publication of JPS6313788B2 publication Critical patent/JPS6313788B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • B23K3/063Solder feeding devices for wire feeding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP22075583A 1983-11-25 1983-11-25 半田球供給装置 Granted JPS59113972A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22075583A JPS59113972A (ja) 1983-11-25 1983-11-25 半田球供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22075583A JPS59113972A (ja) 1983-11-25 1983-11-25 半田球供給装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57007539A Division JPS58125395A (ja) 1982-01-22 1982-01-22 半田球及び半田球供給装置

Publications (2)

Publication Number Publication Date
JPS59113972A true JPS59113972A (ja) 1984-06-30
JPS6313788B2 JPS6313788B2 (show.php) 1988-03-28

Family

ID=16756029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22075583A Granted JPS59113972A (ja) 1983-11-25 1983-11-25 半田球供給装置

Country Status (1)

Country Link
JP (1) JPS59113972A (show.php)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123976U (show.php) * 1974-08-12 1976-02-21
JPS53137831A (en) * 1977-05-09 1978-12-01 Tokai Rika Co Ltd Automatic ingot feed apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123976U (show.php) * 1974-08-12 1976-02-21
JPS53137831A (en) * 1977-05-09 1978-12-01 Tokai Rika Co Ltd Automatic ingot feed apparatus

Also Published As

Publication number Publication date
JPS6313788B2 (show.php) 1988-03-28

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