JPS59113972A - Device for supplying solder ball - Google Patents

Abstract

PURPOSE:To supply adequately and automatically solder balls to a solder tank by providing means for stopping the solder balls falling by its own weight to a feeder for solder balls and controlling the driving of the means for stopping the solder balls by the output from a liquid level detector of the solder tank. CONSTITUTION:A liquid level detector 3 is attached in the solder supplying part 2 of a solder tank 1, and a ball feeder 4 is disposed above the detector. A replenishing pipe 5 leading to the part 2 is connected to the feeder 4 and a discharging pipe 7 of a ball storage tank 6 is connected to the inlet thereof. When the liquid level detected with the detector 3 exceeds the preset lower limit, a solenoid 45 is operated to disengage a pawl 44 from a ratchet gear 43. As a result, a planetary gear 42 is rotated by the weight of a solder ball 10 and the ball 10 is supplied through a replenishing pipe 4 into the tank 1. When the gear 42 delivers a prescribed number of the balls 10, the pawl 44 is engaged again with the gear 43, thereby stopping the rotation of the gear 42.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a supply device that automatically supplies spherical solder material to an automatic soldering device.

In jet-type or immersion-type automatic soldering equipment, in order to perform high-quality soldering on printed wiring boards, etc., it is necessary to maintain a constant liquid level in the solder tank, and the liquid level reduced by soldering must be maintained at a constant level. solder must be replenished into the solder tank.

Conventionally, a boat-shaped solder material with a cross-sectional area of about 20 cm' and a length of 40 to 50 cm was hung with a string, and the string was wrapped around a pulley driven by a motor. When the liquid level drops to the lower limit, the motor starts and the solder rod is placed in the liquid, and when the liquid level reaches the upper limit, the motor stops, replenishing the solder tank with solder. . In order to achieve uniform soldering, it is desirable to reduce the distance between the upper and lower limits of the liquid level in the solder tank, but with the method of replenishing the solder tank with thick rod-shaped solder material, There was a problem in that it was not possible to reduce the fluctuations very much. In addition, an automatic soldering device that replenishes pelletized solder to a solder tank (Japan Institute of Invention and Innovation Publication Technical Report 79-20)
No. 20) has also been proposed, but although small pellet-shaped solder can reduce liquid level fluctuations in the solder tank, it is not transferable because it is disc-shaped, and it can be moved from the storage tank to the tank by using its own weight. hoppers cannot be distributed to other hoppers.

[Object of the Invention] The object of the present invention is to provide a supply device suitable for automatically supplying solder balls with a diameter of about 5 mm to 50 mm that easily roll under their own weight to a half tank. .

[Structure of the Invention] The supply device of the present invention utilizes the transferability of solder balls to supply solder balls to a solder tank, and includes a liquid level detector provided for each solder tank, and a liquid level detector for the solder tank. It consists of a ball thrower that sends out solder balls in response to a signal from the ball thrower, a ball storage tank that supplies solder to the ball thrower, and a replenishment pipe that connects the ball thrower to the solder tank. In order to automatically supply solder balls to each ball storage tank, each ball storage tank is connected to an inclined gutter, and the starting end of the inclined gutter is connected to the lifting port of the ball lifting machine, and the terminal end is connected to the tank of the ball lifting machine. This is desirable.

[Example] A solder ball and its supply device of the present invention will be explained based on an example shown in the drawings. As shown in FIG. 1, a liquid level detector 3 is attached to the solder supply section 2 of the solder tank 1, and a ball thrower 4 is disposed at its 1-force. Supply pipe 5 leading to solder supply section 2 of ball thrower 4
and connect the discharge pipe 7 of the bulb storage tank 6 to the inlet.

As shown in FIG. 2, the ball feeder 4 includes a conduit 41 having an inner diameter slightly larger than the solder ball IO, a star-shaped gear 42 as a separation member facing the opening of the conduit, and a brake on the star-shaped gear. A claw tooth type 43, a claw 44, and a solenoid 45 as control members to
, between the star-shaped float and the claw-shaped float is provided with a train of vehicles 46, and a solenoid 45 is connected to the liquid level detector 3 (FIG. 1) via a circuit 11.

As shown in FIG. 1, the ball storage tank 6 includes a weighing bottom plate 61, an inlet 063 that opens to the inclined gutter 8, and a guide ring 64 provided at the inlet. When it is turned off, it closes, and when it is turned off, it opens and the solder balls 10 rolling on the inclined gutter 8 are taken into the ball storage tank 6. Although the slope angle of the sloped gutter 8 is about 6'', the solder balls 10 freely move down the slope due to their own weight.

A starting end 81 of the inclined gutter 8 is connected to a lifting port 91 of the ball lifting machine 9, and a terminal end 82 is connected to a supply tank 92 of the same ball lifting machine 9.

As shown in FIG. 3, the inclined gutter 8 extending from the lifting port 91 of the ball lifting machine 9 branches into a plurality of inclined gutter. A plurality of ball storage tanks 6 are connected to each branched inclined gutter 8, each ball storage tank 6 is connected to a respective ball thrower 4, and a supply pipe 5 of each ball thrower 4 reaches a respective solder tank 1. Each branched slope gutter 8
The lower ends of the two join together again to form a single tree, and the terminal end 82 enters the supply tank 92 of the ball-lifting machine.

When the solder balls 10 are formed to have the same size as the pachinko balls, the above-mentioned ball thrower 4, ball storage tank 6, inclined gutter 8, and ball lifting machine 9 can be used as they are for pachinko. Also, if the diameter is set to about 30 mm, the weight will be 100 g, making it easy to set boundaries for weight management.

Next, we will explain the solder ball of the present invention and its (Je supply device) liquid level management of the solder tank.Since a wide variety of printed wiring boards are soldered in the same work place, the amount of solder used in each solder tank 1 is The same amount of solder balls is put into the tank 92 of the ball lifter 9 as the entire device consumes during a certain period of time, for example - days, although this varies.

The solder balls 10 in the tank 92 are lifted by the conveyor of the ball lifting machine 9 and sent out from the lifting port 91 to the starting end 81 of the inclined gutter 8. The solder ball 10 that has entered the inclined gutter 8 rolls on the slope of the inclined gutter, enters the branched inclined gutter 8 via the branching device 83, and also rolls along the slope. When the solder balls 10 in the ball storage tank 5 reach a certain amount via the guide ring 64 which is opened in the middle, the weighing bottom plate 61 is lowered and the limit switch 6
Turn on 2. When the limit switch 62 is turned on, the guide ring 64 is closed and the solder balls 1O can no longer enter the ball storage tank 6 from the inclined gutter 8. When all the guide rings 64 of the ball storage tank 6 attached to the branching inclined gutter 8 are closed, the solder balls 10 continue to roll on the inclined gutter 8 and reach the terminal end 8.
2 returns to the tank 92 of the ball-lifting machine 9 again.

A liquid level detector 3 provided in the supply section 2 of each solder tank 1 monitors the solder liquid level, and when the liquid level falls below a preset lower limit, the liquid level detector 3 activates the solenoid 45 through the circuit 11. Remove the pawl 44 from the mold gear. As a result, the star gear 42 rotates due to the weight of the solder ball 10, and the solder ball is supplied to the solder bath 1 via the supply pipe 4. When the star gear 42 sends out a predetermined number of solder balls, the pawl 44 engages the mold gear 43 again.
The rotation of the star gear 42 is stopped. The number of solder balls that the star gear 42 sends out at one time is adjusted by the ratio of the number of teeth in the transmission gear train 46 between the star gear 42 and the mold gear 4.

The stopping member of the feeder is not limited to a star gear, and a worm or the like can also be used, and the solenoid of the driving member can be replaced with a fluid cylinder. Alternatively, the stopping member may be directly rotated by the motor of the driving member instead of the weight of the solder ball, and the on/off of the motor may be controlled by a liquid level detector.

[Effects of the Invention] As described in H, since the solder ball of the present invention has a smaller volume per unit than the conventional solder rod, it is possible to control the range between the upper limit and the lower limit of the liquid level in the solder tank to be extremely small. It is. Therefore, soldering can be performed with higher precision than in the past. A supply device that uses a gentle slope automatically supplies solder balls to all solder tanks, eliminating the need for manual solder replenishment.

[Brief explanation of the drawing]

FIG. 1 is an elevational view showing the main parts of the solder ball and its supply device of the present invention, FIG. 2 is a plan view schematically showing the passage of the solder ball in the supply device of FIG. 1, and FIG. FIG. 2 is a sectional view of the ball thrower shown in FIG. 1; 12 solder tanks, 3: liquid level detector, 4: ball feeder, 5: supply pipe, 6: ball storage tank, 7: publishing pipe, 8: inclined gutter, 9: ball lifting machine, 10: hemisphere... , 11: Circuit, 42: Star gear, 43
: Type gear, 44: Pawl, 45: Solenoid, 81: Start end, 82: End end, 91: Lifting port, 92: Supply tank

Claims (1)

[Scope of Claims] l) a ball storage tank, a discharge pipe forming an outlet of the ball storage tank, a ball thrower connected to the discharge pipe, and a supply pipe forming an outlet of the ball thrower; The device includes a liquid level detector that detects a liquid level in a solder tank and controls the ball thrower, and the ball thrower includes a stop member that prevents solder balls from falling due to their own weight, and a control member that prevents solder balls from falling due to their own weight; 1. A solder ball supplying device comprising a driving member that operates the stopping member under the control of a controller. 2) The entrance of the ball storage tank is connected to an inclined gutter so that opening and closing can be controlled freely, and the starting end of the inclined gutter is connected to the feeding port of the ball lifting machine, and the starting end is connected to the supply tank of the ball lifting machine. The solder ball supply device according to claim 1, characterized in that the balls are supplied to the ball storage tank via a ball lifting machine.