JPS6313788B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a supply device that automatically supplies spherical solder material to an automatic soldering device.

In jet type or immersion type automatic soldering equipment,
In order to perform high-quality soldering on printed wiring boards and the like, it is necessary to maintain a constant liquid level in the solder tank, and it is necessary to replenish the solder tank with the amount of solder lost during soldering. Conventionally, a boat-shaped solder rod with a cross-sectional area of about 20 cm ² and a length of 40 to 50 cm was suspended with a string, and the string was wrapped around a pulley driven by a motor. Solder was replenished into the solder tank by controlling the start and stop, and when the liquid level fell to the lower limit, the motor would start and the solder rod was placed in the liquid, and when the liquid level reached the upper limit, the motor would stop. In order to achieve uniform soldering, it is desirable to reduce the distance between the upper and lower limits of the liquid level in the solder tank, but with the method of replenishing the solder tank with thick rod-shaped solder material, There was a problem in that it was not possible to reduce the fluctuations very much. In addition, an automatic soldering device (Japan Institute of Invention and Innovation Publication Technical Report No. 79-2020) has been proposed that replenishes solder pellets into a solder tank, but small pellet-shaped solder can reduce liquid level fluctuations in the solder tank. However, since it is disc-shaped, it has no rolling properties and cannot be distributed from the storage tank to the hopper of each tank using its own weight.

[Purpose of the invention]

The purpose of this invention is to roll easily under its own weight with a diameter of 5 mm.
An object of the present invention is to provide a supply device suitable for automatically supplying solder balls of about 50 mm to a solder bath.

[Structure of the invention]

The supply device of the present invention utilizes the rolling properties of the solder balls to replenish the solder balls into the solder tank. It consists of a ball thrower that sends out solder balls, a ball storage tank that supplies solder to the ball thrower, and a supply pipe that leads from the ball thrower to the solder tank. In order to automatically supply solder balls to each ball storage tank, each ball storage tank is connected to an inclined gutter, and the starting end of the inclined gutter is connected to the lifting port of the ball lifting machine, and the terminal end is connected to the tank of the ball lifting machine. This is desirable.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS A solder ball and its supply device according to the present invention will be explained based on embodiments shown in the drawings. As shown in Figure 1,
A liquid level detector 3 is attached to the solder supply section 2 of the solder tank 1, and a ball thrower 4 is disposed above it. The supply pipe 5 leading to the solder supply section 2 of the ball thrower 4 is connected, and the discharge pipe 7 of the ball storage tank 6 is connected to the inlet. The ball thrower 4 is
As shown in FIG. 2, there is a conduit 41 with an inner diameter slightly larger than the solder ball 10, a star gear 42 as a separation member facing the opening of the conduit, and a control member for braking the star gear. Pawl gear 43, pawl 44, solenoid 45, and a train 4 between the star gear and the pawl gear.
6, and the solenoid 45 is connected to the liquid level detector 3 (first
) through a circuit 11.

As shown in FIG. 1, the ball storage tank 6 includes a weighing bottom plate 61, an inlet 63 that opens to the inclined gutter 8, and a guide door 64 provided at the inlet.The guide door opens when the limit switch is turned on. It closes and opens when turned off to take the solder balls 10 rolling down the inclined gutter 8 into the ball storage tank 6. Although the slope angle of the sloped gutter 8 is about 6 degrees, the solder balls 10 freely roll down the slope due to their own weight.

The starting end 81 of the inclined gutter 8 is connected to the lifting port 91 of the ball lifting machine 9.
and the terminal end 82 is connected to the supply tank 92 of the same ball-lifting machine 9.

As shown in FIG. 3, the inclined gutter 8 extending from the lifting port 91 of the ball lifting machine 9 branches into a plurality of inclined gutter. A plurality of ball storage tanks 6 are installed in each branched inclined gutter 8.
are connected consecutively, and each ball storage tank 6 has a respective ball thrower 4.
The supply pipe 5 of each ball thrower 4 reaches the respective solder tank 1. The lower ends of each of the branched inclined troughs 8 join together again to become one, and the terminal end 82 enters the supply tank 92 of the ball-lifting machine.

When the solder ball 10 is formed to the same size as a pachinko ball, the above-mentioned ball thrower 4, ball storage tank 6,
As for the inclined gutter 8 and the ball lifting machine 9, those for pachinko can be used as they are. Also, if the diameter is set to about 30mm, the weight will be 100g, making it easy to set boundaries for weight management.

Next, liquid level management in the solder tank using the solder ball and its supply device of the present invention will be explained. Since a wide variety of printed wiring boards are soldered in the same workshop, the amount of solder used in each solder tank 1 varies, but the amount of solder used in each solder tank 1 is the same as that consumed by all the equipment in a certain period, for example, in one day. Tank 9 of ball lifting machine 9
Put it in 2.

The solder balls 10 in the tank 92 are lifted by the conveyor of the ball lifting machine 9 and sent out from the lifting port 91 to the starting end 81 of the inclined gutter 8. The solder ball 10 that has entered the inclined gutter 8 rolls on the slope of the inclined gutter, enters the branched inclined gutter 8 via the branching device 83, and also rolls along the slope. When the solder balls 10 in the ball storage tank 5 reach a certain amount through the guide door 64 which is opened halfway, the weighing bottom plate 61 lowers and the limit switch 6
Turn on 2. When the limit switch 62 is turned on, the guide door 64 is closed and the solder balls 10 can no longer enter the ball storage tank 6 from the inclined gutter 8. Ball storage tank 6 attached to branch slope gutter 8
When all the guide doors 64 are closed, the solder balls 10 continue to roll on the inclined gutter 8 and return to the tank 92 of the ball lifting machine 9 from the terminal end 82.

A liquid level detector 3 provided in the supply section 2 of each solder tank 1 monitors the solder liquid level, and when the liquid level falls below a preset lower limit, the liquid level detector 3 activates the solenoid 45 through the circuit 11. Remove the pawl 44 from the pawl gear. As a result, the star gear 42 rotates due to the weight of the solder ball 10, and the solder ball passes through the supply pipe 4 to the solder tank 1.
supplied to When the star gear 42 sends out a predetermined number of solder balls, the claw 44 engages the claw gear 43 again.
The rotation of the star gear 42 is stopped. The number of solder balls that the star gear 42 sends out at one time is adjusted by the ratio of the number of teeth in the transmission gear train 46 between the star gear 42 and the pawl gear 4.

The stopping member of the feeder is not limited to a star gear, and a worm or the like can also be used, and the solenoid of the driving member can be replaced with a fluid cylinder. Alternatively, the stopping member may be directly rotated by the motor of the driving member instead of the weight of the solder ball, and the on/off of the motor may be controlled by a liquid level detector.

[Effects of the Invention] As mentioned above, since the solder ball of the present invention has a smaller volume per unit than the conventional solder rod, it is possible to control the upper and lower limits of the liquid level in the solder tank to be extremely small. . Therefore, soldering can be performed with higher precision than in the past. A supply device that uses a gentle slope automatically supplies solder balls to all solder tanks, eliminating the need for manual solder replenishment.

[Brief explanation of the drawing]

FIG. 1 is an elevational view showing the main parts of the solder ball and its supply device of the present invention, FIG. 2 is a plan view schematically showing the passage of the solder ball in the supply device of FIG. 1, and FIG. FIG. 2 is a sectional view of the ball thrower shown in FIG. 1; 1: Solder tank, 3: Liquid level detector, 4: Ball thrower,
5: Supply pipe, 6: Ball storage tank, 7: Discharge pipe, 8:
Inclined gutter, 9: Ball lifting machine, 10: Solder ball, 11: Circuit, 42: Star gear, 43: Claw gear, 44: Claw,
45: Solenoid, 81: Starting end, 82: Terminating end, 91: Lifting port, 92: Supply tank.

Claims (1)

[Scope of Claims] 1. A ball storage tank, a discharge pipe forming an outlet of the ball storage tank, a ball thrower connected to the discharge pipe, a supply pipe forming an outlet of the ball thrower, and a solder tank. The device includes a liquid level detector that detects the liquid level of the ball and controls the ball throwing device, wherein the ball throwing device includes a stopping member that prevents the solder ball from rolling and falling due to its own weight, and a liquid level sensor that detects the liquid level of the ball and controls the ball throwing device. A solder ball supply device comprising a drive member that is controlled to operate the stop member. 2. Detecting the liquid level of a ball storage tank, a discharge pipe forming an outlet of the ball storage tank, a ball thrower connected to the discharge pipe, a supply pipe forming an outlet of the ball thrower, and a solder tank. The device is equipped with a liquid level detection meter that controls the ball throwing device, wherein the ball feeding device includes a stopping member that prevents the solder ball from rolling and falling due to its own weight, and a stopping member that is controlled by the liquid level gauge to prevent the solder ball from rolling and falling due to its own weight. It consists of a driving member that operates the member, and is connected to an inclined gutter so that the inlet of the ball storage tank can be opened and closed freely, and the starting end of the inclined gutter is connected to the feeding port of the ball lifting machine, and the terminal end is connected to the supply tank of the ball lifting machine. A solder ball supply device characterized in that the solder balls are connected to a ball lifting machine and supplied to a ball storage tank.