JPS59113637A - 半導体ウェハのテープ接着装置 - Google Patents

半導体ウェハのテープ接着装置

Info

Publication number
JPS59113637A
JPS59113637A JP57223326A JP22332682A JPS59113637A JP S59113637 A JPS59113637 A JP S59113637A JP 57223326 A JP57223326 A JP 57223326A JP 22332682 A JP22332682 A JP 22332682A JP S59113637 A JPS59113637 A JP S59113637A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
tape
adhesive tape
mount frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57223326A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216583B2 (enrdf_load_stackoverflow
Inventor
Takatoshi Ono
小野　喬利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP57223326A priority Critical patent/JPS59113637A/ja
Publication of JPS59113637A publication Critical patent/JPS59113637A/ja
Publication of JPH0216583B2 publication Critical patent/JPH0216583B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP57223326A 1982-12-20 1982-12-20 半導体ウェハのテープ接着装置 Granted JPS59113637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57223326A JPS59113637A (ja) 1982-12-20 1982-12-20 半導体ウェハのテープ接着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57223326A JPS59113637A (ja) 1982-12-20 1982-12-20 半導体ウェハのテープ接着装置

Publications (2)

Publication Number Publication Date
JPS59113637A true JPS59113637A (ja) 1984-06-30
JPH0216583B2 JPH0216583B2 (enrdf_load_stackoverflow) 1990-04-17

Family

ID=16796393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57223326A Granted JPS59113637A (ja) 1982-12-20 1982-12-20 半導体ウェハのテープ接着装置

Country Status (1)

Country Link
JP (1) JPS59113637A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62230561A (ja) * 1986-04-01 1987-10-09 Disco Abrasive Syst Ltd 半導体基板へのテ−プ貼着方法およびテ−プ貼着装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495570A (enrdf_load_stackoverflow) * 1972-05-02 1974-01-18
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495570A (enrdf_load_stackoverflow) * 1972-05-02 1974-01-18
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62230561A (ja) * 1986-04-01 1987-10-09 Disco Abrasive Syst Ltd 半導体基板へのテ−プ貼着方法およびテ−プ貼着装置

Also Published As

Publication number Publication date
JPH0216583B2 (enrdf_load_stackoverflow) 1990-04-17

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