JPS59113632A - ワイヤボンダ− - Google Patents

ワイヤボンダ−

Info

Publication number
JPS59113632A
JPS59113632A JP57224366A JP22436682A JPS59113632A JP S59113632 A JPS59113632 A JP S59113632A JP 57224366 A JP57224366 A JP 57224366A JP 22436682 A JP22436682 A JP 22436682A JP S59113632 A JPS59113632 A JP S59113632A
Authority
JP
Japan
Prior art keywords
comb
combs
bonding
wire
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57224366A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145743B2 (OSRAM
Inventor
Kiyoshi Mayahara
馬屋原　潔
Takeichi Yoshida
吉田　竹一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57224366A priority Critical patent/JPS59113632A/ja
Publication of JPS59113632A publication Critical patent/JPS59113632A/ja
Publication of JPH0145743B2 publication Critical patent/JPH0145743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP57224366A 1982-12-20 1982-12-20 ワイヤボンダ− Granted JPS59113632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224366A JPS59113632A (ja) 1982-12-20 1982-12-20 ワイヤボンダ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224366A JPS59113632A (ja) 1982-12-20 1982-12-20 ワイヤボンダ−

Publications (2)

Publication Number Publication Date
JPS59113632A true JPS59113632A (ja) 1984-06-30
JPH0145743B2 JPH0145743B2 (OSRAM) 1989-10-04

Family

ID=16812624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224366A Granted JPS59113632A (ja) 1982-12-20 1982-12-20 ワイヤボンダ−

Country Status (1)

Country Link
JP (1) JPS59113632A (OSRAM)

Also Published As

Publication number Publication date
JPH0145743B2 (OSRAM) 1989-10-04

Similar Documents

Publication Publication Date Title
US4301958A (en) Arrangement for automatically fabricating and bonding semiconductor devices
JPH10208844A (ja) ワイヤーハーネス用コネクタ端子の実装装置
US3695501A (en) Die bonder apparatus
US8707550B2 (en) Bonding machine incorporating dual-track transfer mechanism
JPH0145743B2 (OSRAM)
JPS59172731A (ja) リ−ドフレ−ム搬送装置
JP3015243B2 (ja) ２以上のボンディングヘッドを有するボンディング装置
KR100252317B1 (ko) 리드 프레임의 다이 본딩장치
CN1121714C (zh) 管芯接合装置
JPS62122224A (ja) フレ−ムフイ−ダ−
JPS594001A (ja) 角チツプ抵抗のテ−ピング装置
CN117153725A (zh) 一种晶圆级封装装置
US20020182759A1 (en) Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same
JPH0543181B2 (OSRAM)
JP2806722B2 (ja) 基板搬送装置
JP2806723B2 (ja) ボンディング検査可能なワイヤボンダー
KR910004927Y1 (ko) 반도체 부품 테이핑기의 부품 정렬 공급장치
JPH03170252A (ja) 部品搬送装置
JPH05338782A (ja) ワーク搬送装置
JPS6146967B2 (OSRAM)
JPS6324884B2 (OSRAM)
KR830000537B1 (ko) 반도체 제품의 자동조립 및 본딩장치
JP2775553B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPH0455527B2 (OSRAM)
JPS6361968A (ja) 部品のハンドラ