JPS59107523A - 半導体素子の保護膜形成方法 - Google Patents

半導体素子の保護膜形成方法

Info

Publication number
JPS59107523A
JPS59107523A JP58229292A JP22929283A JPS59107523A JP S59107523 A JPS59107523 A JP S59107523A JP 58229292 A JP58229292 A JP 58229292A JP 22929283 A JP22929283 A JP 22929283A JP S59107523 A JPS59107523 A JP S59107523A
Authority
JP
Japan
Prior art keywords
polyimide
solution
protective film
precursor
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58229292A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0259622B2 (enrdf_load_stackoverflow
Inventor
Kazumasa Igarashi
一雅 五十嵐
Katsuhiko Yamaguchi
勝彦 山口
Kazuo Iko
伊香　和夫
Kazuyuki Miki
三木　和幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58229292A priority Critical patent/JPS59107523A/ja
Publication of JPS59107523A publication Critical patent/JPS59107523A/ja
Publication of JPH0259622B2 publication Critical patent/JPH0259622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Silicon Polymers (AREA)
JP58229292A 1983-12-05 1983-12-05 半導体素子の保護膜形成方法 Granted JPS59107523A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58229292A JPS59107523A (ja) 1983-12-05 1983-12-05 半導体素子の保護膜形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58229292A JPS59107523A (ja) 1983-12-05 1983-12-05 半導体素子の保護膜形成方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP56029241A Division JPS5813088B2 (ja) 1981-02-27 1981-02-27 シロキサン変性ポリイミド前駆体の製造法

Publications (2)

Publication Number Publication Date
JPS59107523A true JPS59107523A (ja) 1984-06-21
JPH0259622B2 JPH0259622B2 (enrdf_load_stackoverflow) 1990-12-13

Family

ID=16889838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58229292A Granted JPS59107523A (ja) 1983-12-05 1983-12-05 半導体素子の保護膜形成方法

Country Status (1)

Country Link
JP (1) JPS59107523A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260924A (ja) * 1987-03-31 1988-10-27 オクシデンタル　ケミカル　コーポレーション 新規可溶性ポリイミドシロキサン及びその製法及び用途
JPH0211631A (ja) * 1988-06-30 1990-01-16 Nippon Steel Chem Co Ltd 半導体保護用樹脂及び半導体
US5510653A (en) * 1992-05-25 1996-04-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including silicon ladder resin layer
JP2007211204A (ja) * 2006-02-13 2007-08-23 Hitachi Chem Co Ltd 耐熱性樹脂ワニス、耐熱性樹脂ワニスを添加した耐熱性コーティング剤及び耐熱性コーティング剤を用いた絶縁膜又は半導体装置
JP2007246897A (ja) * 2006-02-15 2007-09-27 Hitachi Chem Co Ltd 耐熱性樹脂ペースト、耐熱性樹脂ペーストの製造方法、及び耐熱性樹脂ペーストから得られる絶縁膜又は保護膜を有する半導体装置
US10979241B2 (en) 2015-11-19 2021-04-13 The Lovesac Company Electronic furniture systems with integrated artificial intelligence
US11178486B2 (en) 2015-11-19 2021-11-16 The Lovesac Company Modular furniture speaker assembly with reconfigurable transverse members
US11647840B2 (en) 2021-06-16 2023-05-16 The Lovesac Company Furniture console and methods of using the same
US11689856B2 (en) 2015-11-19 2023-06-27 The Lovesac Company Electronic furniture systems with integrated induction charger
US11805363B2 (en) 2015-11-19 2023-10-31 The Lovesac Company Electronic furniture assembly with integrated internal speaker system including downward oriented speaker
US11832039B2 (en) 2021-04-12 2023-11-28 The Lovesac Company Tuning calibration technology for systems and methods for acoustically correcting sound loss through fabric

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260924A (ja) * 1987-03-31 1988-10-27 オクシデンタル　ケミカル　コーポレーション 新規可溶性ポリイミドシロキサン及びその製法及び用途
JPH0211631A (ja) * 1988-06-30 1990-01-16 Nippon Steel Chem Co Ltd 半導体保護用樹脂及び半導体
US5510653A (en) * 1992-05-25 1996-04-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including silicon ladder resin layer
JP2007211204A (ja) * 2006-02-13 2007-08-23 Hitachi Chem Co Ltd 耐熱性樹脂ワニス、耐熱性樹脂ワニスを添加した耐熱性コーティング剤及び耐熱性コーティング剤を用いた絶縁膜又は半導体装置
JP2007246897A (ja) * 2006-02-15 2007-09-27 Hitachi Chem Co Ltd 耐熱性樹脂ペースト、耐熱性樹脂ペーストの製造方法、及び耐熱性樹脂ペーストから得られる絶縁膜又は保護膜を有する半導体装置
US11178486B2 (en) 2015-11-19 2021-11-16 The Lovesac Company Modular furniture speaker assembly with reconfigurable transverse members
US10979241B2 (en) 2015-11-19 2021-04-13 The Lovesac Company Electronic furniture systems with integrated artificial intelligence
US11689856B2 (en) 2015-11-19 2023-06-27 The Lovesac Company Electronic furniture systems with integrated induction charger
US11805363B2 (en) 2015-11-19 2023-10-31 The Lovesac Company Electronic furniture assembly with integrated internal speaker system including downward oriented speaker
US12052555B2 (en) 2015-11-19 2024-07-30 The Lovesac Company Electronic furniture systems with integrated induction charger
US11832039B2 (en) 2021-04-12 2023-11-28 The Lovesac Company Tuning calibration technology for systems and methods for acoustically correcting sound loss through fabric
US11647840B2 (en) 2021-06-16 2023-05-16 The Lovesac Company Furniture console and methods of using the same
US11871853B2 (en) 2021-06-16 2024-01-16 The Lovesac Company Furniture console and methods of using the same

Also Published As

Publication number Publication date
JPH0259622B2 (enrdf_load_stackoverflow) 1990-12-13

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