JPH0129370B2 - - Google Patents

Info

Publication number
JPH0129370B2
JPH0129370B2 JP58229294A JP22929483A JPH0129370B2 JP H0129370 B2 JPH0129370 B2 JP H0129370B2 JP 58229294 A JP58229294 A JP 58229294A JP 22929483 A JP22929483 A JP 22929483A JP H0129370 B2 JPH0129370 B2 JP H0129370B2
Authority
JP
Japan
Prior art keywords
solution
silicon
precursor
siloxane
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58229294A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59113035A (ja
Inventor
Kazumasa Igarashi
Katsuhiko Yamaguchi
Kazuo Iko
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP22929483A priority Critical patent/JPS59113035A/ja
Publication of JPS59113035A publication Critical patent/JPS59113035A/ja
Publication of JPH0129370B2 publication Critical patent/JPH0129370B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP22929483A 1983-12-05 1983-12-05 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法 Granted JPS59113035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22929483A JPS59113035A (ja) 1983-12-05 1983-12-05 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22929483A JPS59113035A (ja) 1983-12-05 1983-12-05 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP56029241A Division JPS5813088B2 (ja) 1981-02-27 1981-02-27 シロキサン変性ポリイミド前駆体の製造法

Publications (2)

Publication Number Publication Date
JPS59113035A JPS59113035A (ja) 1984-06-29
JPH0129370B2 true JPH0129370B2 (enrdf_load_stackoverflow) 1989-06-09

Family

ID=16889873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22929483A Granted JPS59113035A (ja) 1983-12-05 1983-12-05 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法

Country Status (1)

Country Link
JP (1) JPS59113035A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162025U (enrdf_load_stackoverflow) * 1984-09-28 1986-04-26
DE3615039A1 (de) * 1986-05-03 1987-11-05 Hoechst Ag Polyamidcarbonsaeuren, daraus hergestellte polyimide und verfahren zur herstellung von hochtemperaturbestaendigen schichten
JPS63317554A (ja) * 1987-06-19 1988-12-26 Shin Etsu Chem Co Ltd 液状ポリイミド樹脂組成物
JPH0243221A (ja) * 1988-06-10 1990-02-13 Occidental Chem Corp 新規可溶性ポリイミドシロキサン及びその製法及び用途
JPH0211631A (ja) * 1988-06-30 1990-01-16 Nippon Steel Chem Co Ltd 半導体保護用樹脂及び半導体
KR100405301B1 (ko) * 1999-09-10 2003-11-12 주식회사 엘지화학 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
CN103483586B (zh) * 2013-09-25 2016-04-06 广东生益科技股份有限公司 改性聚酰亚胺树脂、含该改性聚酰亚胺树脂的胶黏剂组合物及含该胶黏剂组合物的覆盖膜

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474677A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Surface stabilizing method of semiconcuctor element using polyimide silicone

Also Published As

Publication number Publication date
JPS59113035A (ja) 1984-06-29

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