JPS59101889A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS59101889A JPS59101889A JP21126282A JP21126282A JPS59101889A JP S59101889 A JPS59101889 A JP S59101889A JP 21126282 A JP21126282 A JP 21126282A JP 21126282 A JP21126282 A JP 21126282A JP S59101889 A JPS59101889 A JP S59101889A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- aqn
- sic
- heat dissipation
- composite heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 17
- 239000002131 composite material Substances 0.000 title claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 16
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims 3
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000167 toxic agent Toxicity 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Laminated Bodies (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21126282A JPS59101889A (ja) | 1982-12-03 | 1982-12-03 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21126282A JPS59101889A (ja) | 1982-12-03 | 1982-12-03 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59101889A true JPS59101889A (ja) | 1984-06-12 |
| JPH0445993B2 JPH0445993B2 (enrdf_load_stackoverflow) | 1992-07-28 |
Family
ID=16602993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21126282A Granted JPS59101889A (ja) | 1982-12-03 | 1982-12-03 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101889A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61119051A (ja) * | 1984-11-15 | 1986-06-06 | Nec Corp | 半導体装置 |
| US4756976A (en) * | 1983-09-30 | 1988-07-12 | Kabushiki Kaisha Toshiba | Ceramic with anisotropic heat conduction |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102374A (en) * | 1980-12-18 | 1982-06-25 | Ricoh Co Ltd | Thermal head |
-
1982
- 1982-12-03 JP JP21126282A patent/JPS59101889A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102374A (en) * | 1980-12-18 | 1982-06-25 | Ricoh Co Ltd | Thermal head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4756976A (en) * | 1983-09-30 | 1988-07-12 | Kabushiki Kaisha Toshiba | Ceramic with anisotropic heat conduction |
| JPS61119051A (ja) * | 1984-11-15 | 1986-06-06 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445993B2 (enrdf_load_stackoverflow) | 1992-07-28 |
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