JPH0445993B2 - - Google Patents

Info

Publication number
JPH0445993B2
JPH0445993B2 JP57211262A JP21126282A JPH0445993B2 JP H0445993 B2 JPH0445993 B2 JP H0445993B2 JP 57211262 A JP57211262 A JP 57211262A JP 21126282 A JP21126282 A JP 21126282A JP H0445993 B2 JPH0445993 B2 JP H0445993B2
Authority
JP
Japan
Prior art keywords
aln
sic
layer
heat dissipation
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57211262A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59101889A (ja
Inventor
Katsutoshi Yoneya
Akihiko Tsuge
Toshiaki Mizutani
Hiroyasu Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP21126282A priority Critical patent/JPS59101889A/ja
Publication of JPS59101889A publication Critical patent/JPS59101889A/ja
Publication of JPH0445993B2 publication Critical patent/JPH0445993B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP21126282A 1982-12-03 1982-12-03 半導体装置 Granted JPS59101889A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21126282A JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21126282A JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Publications (2)

Publication Number Publication Date
JPS59101889A JPS59101889A (ja) 1984-06-12
JPH0445993B2 true JPH0445993B2 (enrdf_load_stackoverflow) 1992-07-28

Family

ID=16602993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21126282A Granted JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Country Status (1)

Country Link
JP (1) JPS59101889A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6073843A (ja) * 1983-09-30 1985-04-26 株式会社東芝 機能性セラミツクス
JPS61119051A (ja) * 1984-11-15 1986-06-06 Nec Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102374A (en) * 1980-12-18 1982-06-25 Ricoh Co Ltd Thermal head

Also Published As

Publication number Publication date
JPS59101889A (ja) 1984-06-12

Similar Documents

Publication Publication Date Title
US4585706A (en) Sintered aluminum nitride semi-conductor device
EP0064386B1 (en) Silicon carbide electrical insulator material of low dielectric constant and manufacturing method therefor
JPS5832073A (ja) 焼結体
JPS5831755B2 (ja) 電気絶縁用基体
JP7611816B2 (ja) 窒化ケイ素焼結体の製造方法
JPH0445993B2 (enrdf_load_stackoverflow)
JP2000128654A (ja) 窒化ケイ素複合基板
JP2004160549A (ja) セラミックス−金属複合体およびこれを用いた高熱伝導放熱用基板
JP3833410B2 (ja) セラミックス回路基板
JPH0313190B2 (enrdf_load_stackoverflow)
JPS6246512B2 (enrdf_load_stackoverflow)
JP7576209B2 (ja) 窒化ケイ素焼結体及びその製造方法、接合体、並びに、パワーモジュール
JP3180100B2 (ja) 半導体モジュール
JPS5815953B2 (ja) 電気的装置用基板
JP2967065B2 (ja) 半導体モジュール
JPH05326743A (ja) 半導体素子搭載用絶縁放熱基板
Omori et al. Fabrication and thermal properties of polyimide/Cu functionally graded material
US5945470A (en) Ceramic-polymer composite material and its use in microelectronics packaging
JP4249371B2 (ja) 金属ベース回路基板
JP2006199584A (ja) セラミックス回路基板の製造方法
JPS59141248A (ja) 半導体基板材料
JPH10154780A (ja) 放熱部品とその製造方法、およびそれを用いた半導体装置
JPS6084713A (ja) 電気絶縁材の製造法
JPS6342414B2 (enrdf_load_stackoverflow)
JPS593436B2 (ja) 焼結用炭火ケイ素粉末組成物