JPS59101889A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59101889A
JPS59101889A JP21126282A JP21126282A JPS59101889A JP S59101889 A JPS59101889 A JP S59101889A JP 21126282 A JP21126282 A JP 21126282A JP 21126282 A JP21126282 A JP 21126282A JP S59101889 A JPS59101889 A JP S59101889A
Authority
JP
Japan
Prior art keywords
layer
aqn
sic
heat dissipation
composite heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21126282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445993B2 (OSRAM
Inventor
勝利 米屋
柘植　章彦
水谷　敏昭
博康 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21126282A priority Critical patent/JPS59101889A/ja
Publication of JPS59101889A publication Critical patent/JPS59101889A/ja
Publication of JPH0445993B2 publication Critical patent/JPH0445993B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Laminated Bodies (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP21126282A 1982-12-03 1982-12-03 半導体装置 Granted JPS59101889A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21126282A JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21126282A JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Publications (2)

Publication Number Publication Date
JPS59101889A true JPS59101889A (ja) 1984-06-12
JPH0445993B2 JPH0445993B2 (OSRAM) 1992-07-28

Family

ID=16602993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21126282A Granted JPS59101889A (ja) 1982-12-03 1982-12-03 半導体装置

Country Status (1)

Country Link
JP (1) JPS59101889A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119051A (ja) * 1984-11-15 1986-06-06 Nec Corp 半導体装置
US4756976A (en) * 1983-09-30 1988-07-12 Kabushiki Kaisha Toshiba Ceramic with anisotropic heat conduction

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102374A (en) * 1980-12-18 1982-06-25 Ricoh Co Ltd Thermal head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102374A (en) * 1980-12-18 1982-06-25 Ricoh Co Ltd Thermal head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756976A (en) * 1983-09-30 1988-07-12 Kabushiki Kaisha Toshiba Ceramic with anisotropic heat conduction
JPS61119051A (ja) * 1984-11-15 1986-06-06 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0445993B2 (OSRAM) 1992-07-28

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