JPS59101499U - Tape carrier for DIP type semiconductor devices - Google Patents
Tape carrier for DIP type semiconductor devicesInfo
- Publication number
- JPS59101499U JPS59101499U JP19655582U JP19655582U JPS59101499U JP S59101499 U JPS59101499 U JP S59101499U JP 19655582 U JP19655582 U JP 19655582U JP 19655582 U JP19655582 U JP 19655582U JP S59101499 U JPS59101499 U JP S59101499U
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- dip type
- tape carrier
- semiconductor devices
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す平面図、第２図はその
Ａ−Ａ断面図、第３図、第４図、第５図はそれぞれ本考
案の他の実施例の平面図、第６図、第７図は更に他の実
施例の断面図である。
１・・・・・・ＤＩＰ型半導体装置、２． １０． １
３・・・・・・導電性樹脂テープ、３． ９． １２・
・・・・・凹部、４・・・・・・送り穴、５・・・・・
・接着テープ、６． ７． ８・・・・・・細幅の接着
テープ、１１・・・・・・フラットパッケージ型半導体
装置。FIG. 1 is a plan view showing one embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A, and FIGS. 3, 4, and 5 are plan views of other embodiments of the present invention, respectively. FIGS. 6 and 7 are sectional views of still other embodiments. 1...DIP type semiconductor device, 2. 10. 1
3... Conductive resin tape, 3. 9. 12・
...Recess, 4...Sprocket hole, 5...
・Adhesive tape, 6. 7. 8...Narrow adhesive tape, 11...Flat package type semiconductor device.
Claims (1)
凹部を等間隔に設け、ＤＩＰ型半導体装置を収納後凹部
を覆うように他の樹脂テープを接着してなるＤＩＰ型半
導体装置用テープキャリア。 ゛A tape carrier for a DIP type semiconductor device, which is formed by providing a conductive resin tape with recesses having a size to accommodate a DIP type semiconductor device at equal intervals, and after storing the DIP type semiconductor device, adhering another resin tape to cover the recesses.゛
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19655582U JPS59101499U (en) | 1982-12-27 | 1982-12-27 | Tape carrier for DIP type semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19655582U JPS59101499U (en) | 1982-12-27 | 1982-12-27 | Tape carrier for DIP type semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101499U true JPS59101499U (en) | 1984-07-09 |
Family
ID=30421624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19655582U Pending JPS59101499U (en) | 1982-12-27 | 1982-12-27 | Tape carrier for DIP type semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101499U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748639B2 (en) * | 1973-09-11 | 1982-10-16 | ||
| JPS5952697B2 (en) * | 1979-03-31 | 1984-12-21 | 小名浜製錬株式会社 | How to operate a copper refining furnace |
-
1982
- 1982-12-27 JP JP19655582U patent/JPS59101499U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748639B2 (en) * | 1973-09-11 | 1982-10-16 | ||
| JPS5952697B2 (en) * | 1979-03-31 | 1984-12-21 | 小名浜製錬株式会社 | How to operate a copper refining furnace |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59101499U (en) | Tape carrier for DIP type semiconductor devices | |
| JPS596839U (en) | semiconductor equipment | |
| JPS6117751U (en) | Tape carrier semiconductor device | |
| JPS60156799U (en) | Chip component connection structure | |
| JPS59188880U (en) | Chip parts taping type storage device | |
| JPS58127700U (en) | Chip electronic component packaging | |
| JPS58150896U (en) | Chip parts taping parts series | |
| JPS59166497U (en) | taping package | |
| JPS5851444U (en) | Magazine case for semiconductor devices | |
| JPS58499U (en) | Semiconductor device carrier | |
| JPS5952697U (en) | packaging tape | |
| JPS6047275U (en) | Taping packaging products for chip parts | |
| JPS6057199U (en) | Taping parts series for chip-shaped electronic parts | |
| JPS5846454U (en) | semiconductor equipment | |
| JPS58120661U (en) | semiconductor equipment | |
| JPS5987197U (en) | Electronic component carrier tape | |
| JPS6114660U (en) | Taping packaging for semiconductor devices | |
| JPS6112299U (en) | Tape for taping semiconductor devices | |
| JPS58148971U (en) | hanger device | |
| JPS60101755U (en) | semiconductor equipment | |
| JPS58131632U (en) | semiconductor equipment | |
| JPS59104587U (en) | Package retention structure | |
| JPS58158467U (en) | electronic components | |
| JPS6047276U (en) | Taping packaging products for chip parts | |
| JPS59146957U (en) | semiconductor equipment |