JPS59104587U - Package retention structure - Google Patents
Package retention structureInfo
- Publication number
- JPS59104587U JPS59104587U JP19766982U JP19766982U JPS59104587U JP S59104587 U JPS59104587 U JP S59104587U JP 19766982 U JP19766982 U JP 19766982U JP 19766982 U JP19766982 U JP 19766982U JP S59104587 U JPS59104587 U JP S59104587U
- Authority
- JP
- Japan
- Prior art keywords
- package
- gap
- retention structure
- holding
- package retention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のパッケージの保持構造を説明するための
斜視図、第2図は本考案に係るパッケージの保持構造の
一実施例を説明するための門は斜視図、bは側面図であ
る。−
図において、1および6は基板、2および5はパッケー
ジ、3は発光素子、4は締付ねじ、11はボス、61お
よび62は突出部、621はストッパをそれぞれ示す。Fig. 1 is a perspective view for explaining a conventional package holding structure, Fig. 2 is a perspective view of a gate for explaining an embodiment of the package holding structure according to the present invention, and b is a side view. . - In the figure, 1 and 6 are substrates, 2 and 5 are packages, 3 is a light emitting element, 4 is a tightening screw, 11 is a boss, 61 and 62 are protrusions, and 621 is a stopper, respectively.
Claims (1)
、該保持構造は弾性を有する合成樹脂成型品からなる基
板上に所定の間隙を隔てた長短1対の突出部で形成する
とともに、該長い突出部に鉤状のストッパを設け、前記
間隙に前記パッケージを挿入保持せしめるようにしたこ
とを特徴とするパッケージの保持構造。This is a structure for holding a package on which electronic components are mounted, and the holding structure is formed of a pair of long and short protrusions separated by a predetermined gap on a substrate made of an elastic synthetic resin molded product. 1. A package holding structure, characterized in that a hook-shaped stopper is provided in the gap, and the package is inserted and held in the gap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19766982U JPS59104587U (en) | 1982-12-29 | 1982-12-29 | Package retention structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19766982U JPS59104587U (en) | 1982-12-29 | 1982-12-29 | Package retention structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59104587U true JPS59104587U (en) | 1984-07-13 |
Family
ID=30423123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19766982U Pending JPS59104587U (en) | 1982-12-29 | 1982-12-29 | Package retention structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59104587U (en) |
-
1982
- 1982-12-29 JP JP19766982U patent/JPS59104587U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59104587U (en) | Package retention structure | |
JPS6033068U (en) | blister packaging | |
JPS59164251U (en) | Lead frame for semiconductor devices | |
JPS6048243U (en) | semiconductor equipment | |
JPS5952697U (en) | packaging tape | |
JPS58140638U (en) | Plastic packaging containers for semiconductor devices | |
JPS58138652U (en) | ribbon fixing device | |
JPS59173379U (en) | panel mounting device | |
JPS59101499U (en) | Tape carrier for DIP type semiconductor devices | |
JPS60113655U (en) | Multi-color light emitting semiconductor device | |
JPS6016549U (en) | Heat sink mounting device | |
JPS60119798U (en) | Magazine for taping leadless electronic components | |
JPS58144855U (en) | semiconductor equipment | |
JPS5923750U (en) | semiconductor equipment | |
JPS5910507U (en) | clip device | |
JPS5912429U (en) | Wiring equipment mounting device | |
JPS59107152U (en) | Lead frame for semiconductor devices | |
JPS6016547U (en) | 3-terminal semiconductor device mounting device | |
JPS6071146U (en) | semiconductor equipment | |
JPS60151143U (en) | Lead frame for semiconductors | |
JPS5931282U (en) | cable holding device | |
JPS6046225U (en) | Fixed structure of plastic molded products | |
JPS58169018U (en) | Assembled packaging for shipping | |
JPS58166086U (en) | printed circuit board guide | |
JPS59153212U (en) | Injection mold equipment |