JPS59104587U - Package retention structure - Google Patents

Package retention structure

Info

Publication number
JPS59104587U
JPS59104587U JP19766982U JP19766982U JPS59104587U JP S59104587 U JPS59104587 U JP S59104587U JP 19766982 U JP19766982 U JP 19766982U JP 19766982 U JP19766982 U JP 19766982U JP S59104587 U JPS59104587 U JP S59104587U
Authority
JP
Japan
Prior art keywords
package
gap
retention structure
holding
package retention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19766982U
Other languages
Japanese (ja)
Inventor
伸夫 井上
勲 中島
勝賀瀬 稔
秀島 信弘
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19766982U priority Critical patent/JPS59104587U/en
Publication of JPS59104587U publication Critical patent/JPS59104587U/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のパッケージの保持構造を説明するための
斜視図、第2図は本考案に係るパッケージの保持構造の
一実施例を説明するための門は斜視図、bは側面図であ
る。− 図において、1および6は基板、2および5はパッケー
ジ、3は発光素子、4は締付ねじ、11はボス、61お
よび62は突出部、621はストッパをそれぞれ示す。
Fig. 1 is a perspective view for explaining a conventional package holding structure, Fig. 2 is a perspective view of a gate for explaining an embodiment of the package holding structure according to the present invention, and b is a side view. . - In the figure, 1 and 6 are substrates, 2 and 5 are packages, 3 is a light emitting element, 4 is a tightening screw, 11 is a boss, 61 and 62 are protrusions, and 621 is a stopper, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を搭載したパッケージを保持する構造であって
、該保持構造は弾性を有する合成樹脂成型品からなる基
板上に所定の間隙を隔てた長短1対の突出部で形成する
とともに、該長い突出部に鉤状のストッパを設け、前記
間隙に前記パッケージを挿入保持せしめるようにしたこ
とを特徴とするパッケージの保持構造。
This is a structure for holding a package on which electronic components are mounted, and the holding structure is formed of a pair of long and short protrusions separated by a predetermined gap on a substrate made of an elastic synthetic resin molded product. 1. A package holding structure, characterized in that a hook-shaped stopper is provided in the gap, and the package is inserted and held in the gap.
JP19766982U 1982-12-29 1982-12-29 Package retention structure Pending JPS59104587U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19766982U JPS59104587U (en) 1982-12-29 1982-12-29 Package retention structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19766982U JPS59104587U (en) 1982-12-29 1982-12-29 Package retention structure

Publications (1)

Publication Number Publication Date
JPS59104587U true JPS59104587U (en) 1984-07-13

Family

ID=30423123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19766982U Pending JPS59104587U (en) 1982-12-29 1982-12-29 Package retention structure

Country Status (1)

Country Link
JP (1) JPS59104587U (en)

Similar Documents

Publication Publication Date Title
JPS59104587U (en) Package retention structure
JPS6033068U (en) blister packaging
JPS59164251U (en) Lead frame for semiconductor devices
JPS6048243U (en) semiconductor equipment
JPS5952697U (en) packaging tape
JPS58140638U (en) Plastic packaging containers for semiconductor devices
JPS58138652U (en) ribbon fixing device
JPS59173379U (en) panel mounting device
JPS59101499U (en) Tape carrier for DIP type semiconductor devices
JPS60113655U (en) Multi-color light emitting semiconductor device
JPS6016549U (en) Heat sink mounting device
JPS60119798U (en) Magazine for taping leadless electronic components
JPS58144855U (en) semiconductor equipment
JPS5923750U (en) semiconductor equipment
JPS5910507U (en) clip device
JPS5912429U (en) Wiring equipment mounting device
JPS59107152U (en) Lead frame for semiconductor devices
JPS6016547U (en) 3-terminal semiconductor device mounting device
JPS6071146U (en) semiconductor equipment
JPS60151143U (en) Lead frame for semiconductors
JPS5931282U (en) cable holding device
JPS6046225U (en) Fixed structure of plastic molded products
JPS58169018U (en) Assembled packaging for shipping
JPS58166086U (en) printed circuit board guide
JPS59153212U (en) Injection mold equipment