JPS6016549U - Heat sink mounting device - Google Patents
Heat sink mounting deviceInfo
- Publication number
- JPS6016549U JPS6016549U JP10639883U JP10639883U JPS6016549U JP S6016549 U JPS6016549 U JP S6016549U JP 10639883 U JP10639883 U JP 10639883U JP 10639883 U JP10639883 U JP 10639883U JP S6016549 U JPS6016549 U JP S6016549U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting device
- metal plate
- sink mounting
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来装置の平面図及び正面図、第２
図ａ、 ｂは本考案の一実施例を示す平面図及び側面
図、第３図ａ、 ｂ、 ｃは本考案装置に使用する
部品（クリップ）の平面図、正面図及び側面図、第４図
、第５図は本考案の他の実施例図である。
図において１は半導体本体、２は金属板、２ａは取付孔
、３は放熱板（フィン）、３ａは取付孔、３ｂ、 ３
ｂ’は突起（ガイド）、４′はビス、５はナツト、６．
６′はコ字状クリップ（締付具）及びその−面、５ａ、
＄ａ’ 、 ５ｂ、 ５ｂ’ 、 ６ｃ。
６Ｃ′は凸部（ガイド）、６ｄは案内部、７はプリント
基板、８は封止（モールド）樹脂、Ｒは電子部品、１３
はコ字状放熱板である。Figures 1a and b are a plan view and front view of the conventional device;
Figures a and b are a plan view and a side view showing one embodiment of the present invention; Figures 3 a, b, and c are a plan view, front view, and side view of parts (clips) used in the device of the present invention; FIG. 5 shows another embodiment of the present invention. In the figure, 1 is the semiconductor body, 2 is the metal plate, 2a is the mounting hole, 3 is the heat sink (fin), 3a is the mounting hole, 3b, 3
b' is a protrusion (guide), 4' is a screw, 5 is a nut, 6.
6' is a U-shaped clip (fastener) and its - face; 5a;
$a', 5b, 5b', 6c. 6C' is a convex part (guide), 6d is a guide part, 7 is a printed circuit board, 8 is a sealing (mold) resin, R is an electronic component, 13
is a U-shaped heat sink.
Claims (2)
夫々孔（又は溝）を設け、前記金属板に前記放熱板を夫
々孔（又は溝）が対応する如く密着せしめ、又対向面に
夫々凸部を有するコ字状クリップを前記凸部が該金属板
及び放熱板の夫々孔（又は溝）に嵌合する如く装着して
該金属板に放熱板を取付るようにしたことを特徴とする
放熱板取付装置。(1) A hole (or groove) is provided in each of the metal plate and the heat sink that protrude from the semiconductor device main body, and the heat sink is brought into close contact with the metal plate so that the holes (or grooves) correspond to each other, and The heat sink is attached to the metal plate by attaching a U-shaped clip having a convex portion such that the convex portion fits into the holes (or grooves) of the metal plate and the heat sink, respectively. Heat sink mounting device.
を設けたことを特徴とする実用新案登録請求の範囲第（
１）項記載の放熱板取付装置。(2) Utility model registration claim No. 1 (
The heat sink mounting device described in item 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10639883U JPS6016549U (en) | 1983-07-08 | 1983-07-08 | Heat sink mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10639883U JPS6016549U (en) | 1983-07-08 | 1983-07-08 | Heat sink mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6016549U true JPS6016549U (en) | 1985-02-04 |
Family
ID=30249003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10639883U Pending JPS6016549U (en) | 1983-07-08 | 1983-07-08 | Heat sink mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016549U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
| JP2016162996A (en) * | 2015-03-05 | 2016-09-05 | Fdk株式会社 | Fixing structure of semiconductor element |
-
1983
- 1983-07-08 JP JP10639883U patent/JPS6016549U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
| JP2016162996A (en) * | 2015-03-05 | 2016-09-05 | Fdk株式会社 | Fixing structure of semiconductor element |
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