JPS5851444U - Magazine case for semiconductor devices - Google Patents

Magazine case for semiconductor devices

Info

Publication number
JPS5851444U
JPS5851444U JP14502781U JP14502781U JPS5851444U JP S5851444 U JPS5851444 U JP S5851444U JP 14502781 U JP14502781 U JP 14502781U JP 14502781 U JP14502781 U JP 14502781U JP S5851444 U JPS5851444 U JP S5851444U
Authority
JP
Japan
Prior art keywords
magazine case
semiconductor devices
semiconductor
synthetic resin
magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14502781U
Other languages
Japanese (ja)
Inventor
天明 英男
Original Assignee
明和樹脂工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 明和樹脂工業株式会社 filed Critical 明和樹脂工業株式会社
Priority to JP14502781U priority Critical patent/JPS5851444U/en
Publication of JPS5851444U publication Critical patent/JPS5851444U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案に係る半導体素子用マガジンケースの
一実施例を示す一部断面斜視図、第2図は、他の実施例
を示す一部断面斜視図である。 1・・・載置部、1′・・・導電性合成樹脂層、2・・
・側壁部、3・・・土壁部。
FIG. 1 is a partially sectional perspective view showing one embodiment of a magazine case for semiconductor elements according to the present invention, and FIG. 2 is a partially sectional perspective view showing another embodiment. 1... Placement part, 1'... Conductive synthetic resin layer, 2...
・Side wall part, 3... Earth wall part.

Claims (1)

【実用新案登録請求の範囲】 1 半導体素子基板を収納するマガジンケースにおいて
、少なくとも半導体素子基板の載置部を導電性合成樹脂
によって形成し、他の部分を透明な合成樹脂によって形
成したことを特徴とする半導体素子用マガジンケース。 2 半導体素子基板の載置部に導電性樹脂層を形成した
実用新案登録請求の範囲第1項記載の半導体素子用マガ
ジンケース。
[Claims for Utility Model Registration] 1. A magazine case for storing semiconductor element substrates, characterized in that at least the mounting part of the semiconductor element substrate is made of conductive synthetic resin, and the other parts are made of transparent synthetic resin. Magazine case for semiconductor devices. 2. A magazine case for semiconductor devices according to claim 1, wherein a conductive resin layer is formed on a mounting portion of a semiconductor device substrate.
JP14502781U 1981-10-01 1981-10-01 Magazine case for semiconductor devices Pending JPS5851444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14502781U JPS5851444U (en) 1981-10-01 1981-10-01 Magazine case for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14502781U JPS5851444U (en) 1981-10-01 1981-10-01 Magazine case for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5851444U true JPS5851444U (en) 1983-04-07

Family

ID=29937970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14502781U Pending JPS5851444U (en) 1981-10-01 1981-10-01 Magazine case for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5851444U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525337B2 (en) * 1974-07-30 1980-07-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525337B2 (en) * 1974-07-30 1980-07-05

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