JPS59191735U - IC mounting device - Google Patents
IC mounting deviceInfo
- Publication number
- JPS59191735U JPS59191735U JP8550583U JP8550583U JPS59191735U JP S59191735 U JPS59191735 U JP S59191735U JP 8550583 U JP8550583 U JP 8550583U JP 8550583 U JP8550583 U JP 8550583U JP S59191735 U JPS59191735 U JP S59191735U
- Authority
- JP
- Japan
- Prior art keywords
- mounting device
- mounting
- notches
- lead terminals
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のICの取付装置の取り付は前の状態を示
す斜視図、第2図はこの考案の一実施例を示すICの取
付装置の取り付は前の状態を示す一斜親図、第3図はこ
の考案の取付装置により基板にICを取り付けた状態の
断面図である。
図中、1はIC,2はリード端子、3は基板、3aは取
付面、5a、5bは切欠部、6a、6bは凸、部である
。なお、図中の同一符号は同一または相当部分を示す。Fig. 1 is a perspective view showing the previous mounting state of a conventional IC mounting device, and Fig. 2 is a perspective view showing an embodiment of the present invention. 3 are cross-sectional views of an IC mounted on a board using the mounting device of this invention. In the figure, 1 is an IC, 2 is a lead terminal, 3 is a substrate, 3a is a mounting surface, 5a and 5b are notches, and 6a and 6b are convex portions. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
の取付装置において、前記ICの前記リード端子が設け
られていない両端部に大きさまたは形状の異なる切欠部
をそれぞれ形成し、一方、前記各切欠部に嵌合し、前記
ICの取付方向および−取付位置を決める凸部を前記基
板の取付面に設けたことを特徴とするICの取付装置。An IC with multiple lead terminals attached to a board
In the mounting device, notches of different sizes or shapes are formed at both ends of the IC where the lead terminals are not provided, and the notches are fitted into the respective notches so that the IC is mounted in the mounting direction and - An IC mounting device characterized in that a convex portion for determining a mounting position is provided on the mounting surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8550583U JPS59191735U (en) | 1983-06-03 | 1983-06-03 | IC mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8550583U JPS59191735U (en) | 1983-06-03 | 1983-06-03 | IC mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59191735U true JPS59191735U (en) | 1984-12-19 |
Family
ID=30215468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8550583U Pending JPS59191735U (en) | 1983-06-03 | 1983-06-03 | IC mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59191735U (en) |
-
1983
- 1983-06-03 JP JP8550583U patent/JPS59191735U/en active Pending
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