JPS60177548U - solid-state imaging device - Google Patents
solid-state imaging deviceInfo
- Publication number
- JPS60177548U JPS60177548U JP1984063282U JP6328284U JPS60177548U JP S60177548 U JPS60177548 U JP S60177548U JP 1984063282 U JP1984063282 U JP 1984063282U JP 6328284 U JP6328284 U JP 6328284U JP S60177548 U JPS60177548 U JP S60177548U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- state
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例に用いる固体撮像素子の斜視
図、第2図は同実施例に用いる固体撮像素子の側面図、
第3図は同実施例の固体撮像装置の側面図、第4図は本
考案の他の実施例に用いる固体撮像素子の斜視図、第5
図は従来例に用いる固体撮像素子の斜視図、第6図は従
来例に用いる固体撮像素子の側面図、第7図は従来例の
固体撮像袋−の側面図である。
1・・・固体撮像素子、3・・・撮像面、4・・・端子
、5・・・基板、5a・・・窓孔。FIG. 1 is a perspective view of a solid-state image sensor used in an embodiment of the present invention, and FIG. 2 is a side view of a solid-state image sensor used in the embodiment.
3 is a side view of the solid-state imaging device of the same embodiment, FIG. 4 is a perspective view of the solid-state imaging device used in another embodiment of the present invention, and FIG.
6 is a side view of the solid-state imaging device used in the conventional example, and FIG. 7 is a side view of a solid-state imaging bag in the conventional example. DESCRIPTION OF SYMBOLS 1... Solid-state imaging device, 3... Imaging surface, 4... Terminal, 5... Substrate, 5a... Window hole.
Claims (1)
記固体撮像素子の取付部に窓孔を設はル基板とを備え、
前記窓孔に前記固体撮像素子の撮像面を露出させて取付
けることを特徴とする固体撮像装置。A solid-state image sensor having a plurality of terminals protruding toward an imaging surface, and a board having a window hole in a mounting portion of the solid-state image sensor,
A solid-state imaging device characterized in that the solid-state imaging device is mounted in the window hole with an imaging surface of the solid-state imaging device exposed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984063282U JPS60177548U (en) | 1984-04-28 | 1984-04-28 | solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984063282U JPS60177548U (en) | 1984-04-28 | 1984-04-28 | solid-state imaging device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60177548U true JPS60177548U (en) | 1985-11-26 |
Family
ID=30593273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984063282U Pending JPS60177548U (en) | 1984-04-28 | 1984-04-28 | solid-state imaging device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60177548U (en) |
-
1984
- 1984-04-28 JP JP1984063282U patent/JPS60177548U/en active Pending
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