JPS6114660U - Taping packaging for semiconductor devices - Google Patents

Taping packaging for semiconductor devices

Info

Publication number
JPS6114660U
JPS6114660U JP9750284U JP9750284U JPS6114660U JP S6114660 U JPS6114660 U JP S6114660U JP 9750284 U JP9750284 U JP 9750284U JP 9750284 U JP9750284 U JP 9750284U JP S6114660 U JPS6114660 U JP S6114660U
Authority
JP
Japan
Prior art keywords
taping packaging
semiconductor devices
tape
carrier tape
taping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9750284U
Other languages
Japanese (ja)
Inventor
勉 鈴木
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9750284U priority Critical patent/JPS6114660U/en
Publication of JPS6114660U publication Critical patent/JPS6114660U/en
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第′１図ａは従来のテーピング包装の平面図く同図ｂは
その断面図である。 第２図は本考案の一実施例の平面図である。 １・・・キャリアテニプ、２・・・カバ―テープ、３・
・・貼り付け部、４・・・製品ポケット部、５・・・電
子部品。Figure 1a is a plan view of a conventional taping package, and Figure 1b is a sectional view thereof. FIG. 2 is a plan view of an embodiment of the present invention. 1...Carrier tape, 2...Cover tape, 3.
...Paste part, 4...Product pocket part, 5...Electronic component.

Claims (1)

【実用新案登録請求の範囲】 １ 半導体装置をキャリアテープの製品ポケット部へ収
納し、カバーテープをキャリアテープに貼り付けて包装
したテーピング包装において、貼り付け部の形状を一定
の長さで間歇に行なったことを特徴とする半導体装置の
テーピング包装。 ２ 前記力バーテープと前記キャリアテープとの貼り付
け部はおのおの前記製品ポケット部から外方に延長して
いることを特徴とする実用新案登録請求の範囲第１項記
載の半導体装置のテーピング包装。[Scope of Claim for Utility Model Registration] 1. In taping packaging in which a semiconductor device is stored in a product pocket of a carrier tape and a cover tape is attached to the carrier tape, the shape of the attached portion is intermittently fixed at a certain length. Taping packaging for semiconductor devices characterized by the following. 2. The taping packaging for a semiconductor device according to claim 1, wherein the bonding portions of the force bar tape and the carrier tape each extend outward from the product pocket portion.
JP9750284U 1984-06-28 1984-06-28 Taping packaging for semiconductor devices Pending JPS6114660U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9750284U JPS6114660U (en) 1984-06-28 1984-06-28 Taping packaging for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9750284U JPS6114660U (en) 1984-06-28 1984-06-28 Taping packaging for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6114660U true JPS6114660U (en) 1986-01-28

Family

ID=30657058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9750284U Pending JPS6114660U (en) 1984-06-28 1984-06-28 Taping packaging for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6114660U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0445259U (en) * 1990-08-21 1992-04-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0445259U (en) * 1990-08-21 1992-04-16

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