JPS6047276U - Taping packaging products for chip parts - Google Patents
Taping packaging products for chip partsInfo
- Publication number
- JPS6047276U JPS6047276U JP13882583U JP13882583U JPS6047276U JP S6047276 U JPS6047276 U JP S6047276U JP 13882583 U JP13882583 U JP 13882583U JP 13882583 U JP13882583 U JP 13882583U JP S6047276 U JPS6047276 U JP S6047276U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- chip parts
- packaging products
- parts
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案のチップ部品用テーピング包装品の一実
施例を示す一部カバーテープを剥した状態の上面図、第
２図は回能の実施例を示す一部カバーテープを剥した状
態の上面図、第３図は同断面図である。
１・・・・・・キャリアテープ、２・・・・・・チップ
部品、３・・・・・べぼみ穴、４・・・・・・カバーテ
ープ、５・・・・・・接着剤、６・・・・・・送り孔、
７・・・・・・打抜き孔、８・・・・・・ボトムテープ
。Fig. 1 is a top view of an embodiment of the taped packaged product for chip components of the present invention with the cover tape partially removed, and Fig. 2 is a top view of an embodiment of the taped package for chip components of the present invention with the cover tape partially removed. The top view and FIG. 3 are sectional views of the same. 1... Carrier tape, 2... Chip parts, 3... Recessed hole, 4... Cover tape, 5... Adhesive , 6... feed hole,
7...Punching hole, 8...Bottom tape.
Claims (1)
に貼付けるカバーテープ、または、チップ部品を収納す
る打抜き孔を有するキャリアテープに貼付けるボトムテ
ープとカバーテープのキャリアテープへの貼合せ面のく
ぼみ穴または打抜き孔に対応する部分を除いた部分に接
着剤を施してなるチップ部品用テーピング包装品。A cover tape that is attached to a carrier tape that has a hollow hole for storing chip components, or a bottom tape that is attached to a carrier tape that has a punched hole that accommodates a chip component, and a hollow hole or A tape-packed product for chip parts that is made with adhesive applied to the parts except for the parts corresponding to the punched holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13882583U JPS6047276U (en) | 1983-09-07 | 1983-09-07 | Taping packaging products for chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13882583U JPS6047276U (en) | 1983-09-07 | 1983-09-07 | Taping packaging products for chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6047276U true JPS6047276U (en) | 1985-04-03 |
Family
ID=30311363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13882583U Pending JPS6047276U (en) | 1983-09-07 | 1983-09-07 | Taping packaging products for chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047276U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (en) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | Electronic part assembly |
-
1983
- 1983-09-07 JP JP13882583U patent/JPS6047276U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (en) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | Electronic part assembly |
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