JPS6047276U - Taping packaging products for chip parts - Google Patents

Taping packaging products for chip parts

Info

Publication number
JPS6047276U
JPS6047276U JP13882583U JP13882583U JPS6047276U JP S6047276 U JPS6047276 U JP S6047276U JP 13882583 U JP13882583 U JP 13882583U JP 13882583 U JP13882583 U JP 13882583U JP S6047276 U JPS6047276 U JP S6047276U
Authority
JP
Japan
Prior art keywords
tape
chip parts
packaging products
parts
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13882583U
Other languages
Japanese (ja)
Inventor
博史 伊藤
津田 直輝
黒田 孝之
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP13882583U priority Critical patent/JPS6047276U/en
Publication of JPS6047276U publication Critical patent/JPS6047276U/en
Pending legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のチップ部品用テーピング包装品の一実
施例を示す一部カバーテープを剥した状態の上面図、第
2図は回能の実施例を示す一部カバーテープを剥した状
態の上面図、第3図は同断面図である。 1・・・・・・キャリアテープ、2・・・・・・チップ
部品、3・・・・・べぼみ穴、4・・・・・・カバーテ
ープ、5・・・・・・接着剤、6・・・・・・送り孔、
7・・・・・・打抜き孔、8・・・・・・ボトムテープ
Fig. 1 is a top view of an embodiment of the taped packaged product for chip components of the present invention with the cover tape partially removed, and Fig. 2 is a top view of an embodiment of the taped package for chip components of the present invention with the cover tape partially removed. The top view and FIG. 3 are sectional views of the same. 1... Carrier tape, 2... Chip parts, 3... Recessed hole, 4... Cover tape, 5... Adhesive , 6... feed hole,
7...Punching hole, 8...Bottom tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品を収納するくぼみ穴を有するキャリアテープ
に貼付けるカバーテープ、または、チップ部品を収納す
る打抜き孔を有するキャリアテープに貼付けるボトムテ
ープとカバーテープのキャリアテープへの貼合せ面のく
ぼみ穴または打抜き孔に対応する部分を除いた部分に接
着剤を施してなるチップ部品用テーピング包装品。
A cover tape that is attached to a carrier tape that has a hollow hole for storing chip components, or a bottom tape that is attached to a carrier tape that has a punched hole that accommodates a chip component, and a hollow hole or A tape-packed product for chip parts that is made with adhesive applied to the parts except for the parts corresponding to the punched holes.
JP13882583U 1983-09-07 1983-09-07 Taping packaging products for chip parts Pending JPS6047276U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13882583U JPS6047276U (en) 1983-09-07 1983-09-07 Taping packaging products for chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13882583U JPS6047276U (en) 1983-09-07 1983-09-07 Taping packaging products for chip parts

Publications (1)

Publication Number Publication Date
JPS6047276U true JPS6047276U (en) 1985-04-03

Family

ID=30311363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13882583U Pending JPS6047276U (en) 1983-09-07 1983-09-07 Taping packaging products for chip parts

Country Status (1)

Country Link
JP (1) JPS6047276U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827398A (en) * 1981-08-11 1983-02-18 松下電器産業株式会社 Electronic part assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827398A (en) * 1981-08-11 1983-02-18 松下電器産業株式会社 Electronic part assembly

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