JPS59100806A - Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置 - Google Patents

Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置

Info

Publication number
JPS59100806A
JPS59100806A JP57211085A JP21108582A JPS59100806A JP S59100806 A JPS59100806 A JP S59100806A JP 57211085 A JP57211085 A JP 57211085A JP 21108582 A JP21108582 A JP 21108582A JP S59100806 A JPS59100806 A JP S59100806A
Authority
JP
Japan
Prior art keywords
wafer
chuck
orientation flat
pulses
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57211085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0248043B2 (enExample
Inventor
Hisashi Nakamoto
中本 久
Masane Suzuki
鈴木 正根
Shigeru Inaba
茂 稲葉
Masaaki Chikaike
正明 近池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHUO RIKEN KK
MITSUI BUSSAN DENSHI HANBAI KK
S G INSTR KK
Fujinon Corp
Original Assignee
CHUO RIKEN KK
MITSUI BUSSAN DENSHI HANBAI KK
S G INSTR KK
Fujinon Corp
Fuji Photo Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHUO RIKEN KK, MITSUI BUSSAN DENSHI HANBAI KK, S G INSTR KK, Fujinon Corp, Fuji Photo Optical Co Ltd filed Critical CHUO RIKEN KK
Priority to JP57211085A priority Critical patent/JPS59100806A/ja
Publication of JPS59100806A publication Critical patent/JPS59100806A/ja
Publication of JPH0248043B2 publication Critical patent/JPH0248043B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
    • G03F9/7057—Gas flow, e.g. for focusing, leveling or gap setting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Specific Conveyance Elements (AREA)
JP57211085A 1982-12-01 1982-12-01 Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置 Granted JPS59100806A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57211085A JPS59100806A (ja) 1982-12-01 1982-12-01 Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57211085A JPS59100806A (ja) 1982-12-01 1982-12-01 Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置

Publications (2)

Publication Number Publication Date
JPS59100806A true JPS59100806A (ja) 1984-06-11
JPH0248043B2 JPH0248043B2 (enExample) 1990-10-23

Family

ID=16600164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57211085A Granted JPS59100806A (ja) 1982-12-01 1982-12-01 Lsi用ウエ−ハの平面度検査装置におけるウエ−ハ角度位置合せ・移送装置

Country Status (1)

Country Link
JP (1) JPS59100806A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254304A (ja) * 1985-05-02 1986-11-12 日東電工株式会社 ウエハの位置合せ方法
JPS6238304A (ja) * 1985-08-14 1987-02-19 Hitachi Denshi Syst Service Kk Icウエハの自動位置決め装置
JP2007286072A (ja) * 2007-08-06 2007-11-01 Kobe Steel Ltd 平坦度測定方法及びその装置
KR101129056B1 (ko) 2010-03-22 2012-03-27 대원강업주식회사 소형 압축 스프링의 코일 내경 검사장치
CN108225237A (zh) * 2017-12-29 2018-06-29 南阳英良石业有限公司 一种负压式人造石制备用检测装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254304A (ja) * 1985-05-02 1986-11-12 日東電工株式会社 ウエハの位置合せ方法
JPS6238304A (ja) * 1985-08-14 1987-02-19 Hitachi Denshi Syst Service Kk Icウエハの自動位置決め装置
JP2007286072A (ja) * 2007-08-06 2007-11-01 Kobe Steel Ltd 平坦度測定方法及びその装置
KR101129056B1 (ko) 2010-03-22 2012-03-27 대원강업주식회사 소형 압축 스프링의 코일 내경 검사장치
CN108225237A (zh) * 2017-12-29 2018-06-29 南阳英良石业有限公司 一种负压式人造石制备用检测装置

Also Published As

Publication number Publication date
JPH0248043B2 (enExample) 1990-10-23

Similar Documents

Publication Publication Date Title
US6468022B1 (en) Edge-gripping pre-aligner
US4695215A (en) Device for automatically transporting disk shaped objects
US4818169A (en) Automated wafer inspection system
US4944650A (en) Apparatus for detecting and centering wafer
US6932558B2 (en) Wafer aligner
KR102136085B1 (ko) 웨이퍼의 에지 영역 검사장치
US4103232A (en) Wafer transfer device
US4846626A (en) Wafer handling system
US6357996B2 (en) Edge gripping specimen prealigner
CN1170655A (zh) 晶片自动研磨系统
JP3845552B2 (ja) ドリル研磨システム及び塵埃除去装置
US20020172585A1 (en) Device and method for aligning disk-shaped substrates
JP2001077179A (ja) 半導体基板アライナー装置および方法
US4236413A (en) Testing apparatus for tablet-shaped specimens
US3446065A (en) Automatic probing apparatus
EP0905502B1 (en) A probe apparatus and a method for polishing a probe
US4973217A (en) Wafer handling system
JP2995435B2 (ja) チップ自動選別搬送装置
JPH0248043B2 (enExample)
JP3072484B2 (ja) ウエハ位置決め装置
JP3791698B2 (ja) ウエハ検査装置
CN117339912A (zh) 一种基于机器视觉的自动摆盘测电阻装置
JPH1022368A (ja) ウェーハのオリエンテーションフラット位置決め方法及びウェーハチャック及び半導体製造/試験装置
JP3704365B2 (ja) ウエハ検査装置
US20020075478A1 (en) Inspection device having wafer exchange stage