JPS5898935A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5898935A
JPS5898935A JP19785181A JP19785181A JPS5898935A JP S5898935 A JPS5898935 A JP S5898935A JP 19785181 A JP19785181 A JP 19785181A JP 19785181 A JP19785181 A JP 19785181A JP S5898935 A JPS5898935 A JP S5898935A
Authority
JP
Japan
Prior art keywords
film
substrate
oxide film
silicon
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19785181A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0427692B2 (enrdf_load_stackoverflow
Inventor
Kohei Higuchi
行平 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP19785181A priority Critical patent/JPS5898935A/ja
Publication of JPS5898935A publication Critical patent/JPS5898935A/ja
Publication of JPH0427692B2 publication Critical patent/JPH0427692B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
JP19785181A 1981-12-09 1981-12-09 半導体装置の製造方法 Granted JPS5898935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19785181A JPS5898935A (ja) 1981-12-09 1981-12-09 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19785181A JPS5898935A (ja) 1981-12-09 1981-12-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5898935A true JPS5898935A (ja) 1983-06-13
JPH0427692B2 JPH0427692B2 (enrdf_load_stackoverflow) 1992-05-12

Family

ID=16381387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19785181A Granted JPS5898935A (ja) 1981-12-09 1981-12-09 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5898935A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0427692B2 (enrdf_load_stackoverflow) 1992-05-12

Similar Documents

Publication Publication Date Title
JPH0529133B2 (enrdf_load_stackoverflow)
US4398992A (en) Defect free zero oxide encroachment process for semiconductor fabrication
JPS6359251B2 (enrdf_load_stackoverflow)
JPH07161704A (ja) 半導体装置の素子隔離膜の作製方法
JPS6174350A (ja) 半導体装置の製造方法
JPS5898935A (ja) 半導体装置の製造方法
US6194319B1 (en) Semiconductor processing method of reducing an etch rate of one portion of a doped material relative to another portion, and methods of forming openings
JPH0917780A (ja) 半導体装置の素子分離膜の形成方法
JP2586431B2 (ja) 半導体装置の製造方法
JPH079930B2 (ja) 半導体装置の製造方法
EP0336515B1 (en) Method of manufacturing a semiconductor device having a silicon substrate with fully or partly sunken field oxide regions
JPS63152155A (ja) 半導体装置の製造方法
JPH0370156A (ja) 半導体装置の製造方法
JPS6116530A (ja) 半導体装置の製造方法
JPS6248028A (ja) フイ−ルド酸化膜の形成方法
JP2524431B2 (ja) イオン注入阻止方法
JPS63300509A (ja) 半導体装置の製造方法
JP2762447B2 (ja) 半導体装置の製造方法
JPH02283029A (ja) 半導体装置の製造方法
JPH04298019A (ja) 量子井戸構造体及びその製造方法
JPH01138749A (ja) 半導体装置の製造方法
JPS62142327A (ja) 半導体装置の製造方法
JPH0458538A (ja) 半導体装置の製造方法
JPS6257103B2 (enrdf_load_stackoverflow)
JPS60145609A (ja) 化合物半導体装置の製造方法