JPS589399A - 金属芯印刷配線板の製造方法 - Google Patents
金属芯印刷配線板の製造方法Info
- Publication number
- JPS589399A JPS589399A JP10675381A JP10675381A JPS589399A JP S589399 A JPS589399 A JP S589399A JP 10675381 A JP10675381 A JP 10675381A JP 10675381 A JP10675381 A JP 10675381A JP S589399 A JPS589399 A JP S589399A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- insulating film
- circuit
- metal core
- flexible insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 23
- 229910052751 metal Inorganic materials 0.000 title claims description 21
- 239000002184 metal Substances 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10675381A JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10675381A JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS589399A true JPS589399A (ja) | 1983-01-19 |
| JPS6362920B2 JPS6362920B2 (enrdf_load_stackoverflow) | 1988-12-05 |
Family
ID=14441665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10675381A Granted JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589399A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4780957A (en) * | 1987-03-19 | 1988-11-01 | Furukawa Denki Kogyo Kabushiki Kaisha | Method for producing rigid-type multilayer printed wiring board |
| US4845313A (en) * | 1985-07-22 | 1989-07-04 | Tokyo Communication Equipment Co., Ltd. | Metallic core wiring substrate |
| WO1990007857A1 (en) * | 1985-07-22 | 1990-07-12 | Satoru Endoh | Metal core wiring board |
| US6175084B1 (en) | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5136569A (en) * | 1974-09-21 | 1976-03-27 | Mitsubishi Electric Corp | Konseishusekikairo no seizohoho |
| JPS557356U (enrdf_load_stackoverflow) * | 1978-06-28 | 1980-01-18 |
-
1981
- 1981-07-08 JP JP10675381A patent/JPS589399A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5136569A (en) * | 1974-09-21 | 1976-03-27 | Mitsubishi Electric Corp | Konseishusekikairo no seizohoho |
| JPS557356U (enrdf_load_stackoverflow) * | 1978-06-28 | 1980-01-18 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845313A (en) * | 1985-07-22 | 1989-07-04 | Tokyo Communication Equipment Co., Ltd. | Metallic core wiring substrate |
| WO1990007857A1 (en) * | 1985-07-22 | 1990-07-12 | Satoru Endoh | Metal core wiring board |
| US4780957A (en) * | 1987-03-19 | 1988-11-01 | Furukawa Denki Kogyo Kabushiki Kaisha | Method for producing rigid-type multilayer printed wiring board |
| US6175084B1 (en) | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
| US6369332B1 (en) | 1995-04-12 | 2002-04-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate with heat conducting adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362920B2 (enrdf_load_stackoverflow) | 1988-12-05 |
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