JPS588947U - 半導体装置用のリ−ドフレ−ム - Google Patents

半導体装置用のリ−ドフレ−ム

Info

Publication number
JPS588947U
JPS588947U JP10311681U JP10311681U JPS588947U JP S588947 U JPS588947 U JP S588947U JP 10311681 U JP10311681 U JP 10311681U JP 10311681 U JP10311681 U JP 10311681U JP S588947 U JPS588947 U JP S588947U
Authority
JP
Japan
Prior art keywords
lead
lead frame
semiconductor devices
integrally connected
tie bars
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10311681U
Other languages
English (en)
Inventor
寛 山田
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP10311681U priority Critical patent/JPS588947U/ja
Publication of JPS588947U publication Critical patent/JPS588947U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の平面図、第２図は半導体装置の要部破
断平面図、第３図は第２図の側面図、第４図は本案の一
実施例を示す平面図、第５図は半導体装置の要部破断平
面図、第６図は第５図の側面図である。 図中、１は放熱板、２．４ａ、　４ｂハタイハ−１４は
リード、４１〜４３はリード片、４．はダミーリード片
、５は半導体素子、６は金属細線、７は樹脂材である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂モールｐ予定部を除く部分部分をタイバーにて一体
    的に接続した複数の放熱板と、複数のリード片毎にダミ
    ーリード片を位置させ、かつそれぞれをタイバーにて一
    体的に接続したリードとを具備し、上記リードにおける
    ダミーリード片の自由端を放熱板間のタイバーに固定し
    たことを特徴とする半導体装置用のリードフレーム。
JP10311681U 1981-07-10 1981-07-10 半導体装置用のリ−ドフレ−ム Pending JPS588947U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10311681U JPS588947U (ja) 1981-07-10 1981-07-10 半導体装置用のリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10311681U JPS588947U (ja) 1981-07-10 1981-07-10 半導体装置用のリ−ドフレ−ム

Publications (1)

Publication Number Publication Date
JPS588947U true JPS588947U (ja) 1983-01-20

Family

ID=29897743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10311681U Pending JPS588947U (ja) 1981-07-10 1981-07-10 半導体装置用のリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS588947U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122986U (ja) * 1986-01-29 1987-08-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122986U (ja) * 1986-01-29 1987-08-04
JPH0533828Y2 (ja) * 1986-01-29 1993-08-27

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