JPS5885590A - Film substrate structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] FIELD OF THE INVENTION The present invention relates to film substrate structures.

A well-known conventional film substrate structure is one in which copper foil +31 is attached with adhesive (2) to both sides of a heat-resistant plastic layer (1) made of polyimide, polyacidoimide, etc., as shown in Figure 1≦2. It is. The film strip structure a is used as a flexible circuit board for many electronic tensioners. Film carrier method《The biggest feature is the two-way success rate.

However, the film substrate structure using polyimide etc. is generally popular because the plastic layer (1) made of polyimide etc. that intersects the copper foil 131 is extremely expensive, costing about 10,000 yen per 1 m2 of μD. This is because there is.

The present invention was made with a view to the point of view. lIi! The aim is to realize an inexpensive film substrate structure.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the younger brother 2 and the younger 5 figures.

The film substrate structure according to the present invention (1) is as shown in Fig. 2,
It is formed by adhering two pieces of copper foil (111fl2) to both sides of gold leaf 03 for holding a pattern using a thermosetting cap adhesive [141].

The two copper foils IDG3 are approximately 3cm thick, which is used for printed circuit boards, etc.
Use a copper foil with a thickness of 5 μm, and apply adhesive Q4 made of heat-curable resin such as epoxy resin on one side of the copper foil (111-thickness).
For example, as a thermosetting material, the one described in Japanese Patent Publication No. 55-20394 can be used. stomach. Gold foil for documents (13 is 50-100
Although μ-thick aluminum foil is inexpensive and suitable, copper foil may also be used. Two pieces of copper foil Q11GZ and document metal foil (13 are electrically insulated from each other by l1 about 15-30μ thick adhesive (14J, minimum 600V, average 250V)
The insulation resistance of DV is affected. However, since the adhesive circle is an R layer, there is a risk that the thin layer of adhesive f141 will be torn in the cutting direction when press cutting is performed, resulting in a short circuit.

The film substrate to be rejected has a predetermined width, for example, approximately 5 mm width C.
This strip-shaped film substrate Oe is then wound onto a cartridge in units of 5 Qm in length as a strip-shaped film.
As shown in Fig. 6, index holes (171) are punched out at regular intervals on both ends where the desired lead pattern is not provided, and the index holes 0η are used as markers 1 to index the position in the moving step. The copper foil o11 on one side of the film base mentioned above, which is used for transporting the film substrate, is selectively etched to form a desired IJ pattern +1d as shown in FIG. fH1 each electrically (two independently shaped 11, concrete +1; r
Each of the chambers [IJ - (163). Further, since the lead pattern oe is formed by etching, no undesired force is applied to the lead pattern oe, so that the thin layer of the adhesive 041 will not be broken and a short circuit will not occur. In addition, one copper foil qll is used at the position determined by the lead pattern GO index hole 07) to continuously form 151 L pieces at constant intervals to adapt to the film carrier type production process.

The other copper foil 412 of the film board is shown in FIG.
A part C2 fixing pattern (a) corresponding to ff1<fixing pad (161) is provided. If it is necessary to perform multilayer wiring, a conductive path c21) is formed using the other copper foil 0, and is connected through-hole to the lead pattern dQ on the 7th anti-kr side. The fixed pattern (2) and the conductor f2D are formed by etching in the same way as the lead pattern ue.

Etching of the two copper foils (Fll103) of the film substrate was carried out on both sides (after screen printing the resist in the desired shape, the two film substrates were fed into the blood etching device one after another, and the etching acid was applied on opposite sides). The film substrate, on which the predetermined lead patterns 0Q and 13%IT] have been formed by etching both sides at the same time by spraying from a provided nozzle, is wound up into a cartridge and then indexed from the cartridge. It is supplied frame by frame using the hole Gη, and as shown in FIG. 5, the fixing pad (161) c is fixed to the semiconductor element, etc., and the semiconductor element + n 41 quantity and the corresponding magnetic pole lead (163) are bonded with a thin bonding wire. Connecting.

On the other hand, after screen-printing creamy solder on the fixing pattern (a), a metal piece with good thermal conductivity for heat radiation is fixed.

At this time, the fourth version lead (163) is energized to inspect the overall circuit function including the semiconductor device and other circuit elements, and if necessary, functional trimming can be performed.

If the specified circuit function cannot be obtained through this inspection, the semiconductor device, etc., should be replaced and remanufactured - or a mark may be placed on it and subsequent assembly processes may be discontinued in order to improve the yield of the finished product. After that, a silicon range is applied to the semiconductor device and circuit elements that require protection to protect the device and the bonding wire.

Afterwards, leave it in film form and use it as an electric 1i 11-de (163).
The other end (after soldering the two external terminal bowls, expose the external terminal (to) and mold the whole with one finger, then seal 1):
The film substrate 09 is cut at the end of the d finger to separate it into individual components shown in FIG.

As detailed above, according to the present invention, an extremely inexpensive film board structure with good heat dissipation can be realized using two copper foils and one metal foil for the fork, and a large number of lead patterns can be formed using the copper foil. By forming them continuously, a film carrier method can be applied and productivity can be obtained. Furthermore, the film carrier method can be applied to circuits with high power consumption, which was considered impossible in the past, and good heat dissipation can be ensured by using metal pieces according to the power consumption.

[Brief explanation of the drawing]

Fig. 1 is a sectional view illustrating the horizontal orientation of a conventional film substrate using a heat-resistant plastic layer such as polyimide, Fig. 2 is a sectional view showing the film substrate structure of the present invention, and Figs. FIG. 5 is a cross-sectional view of a semiconductor device using the film substrate of the present invention. , Figure 1. Explanation of the main drawing numbers (ID: W4 foil, A3 is metal foil for support, (151 is film substrate, 00 is lead pattern, 07I is index hole, 1% is semiconductor Element, θ is a metal piece, @ is an external terminal. Applicant: 1 person other than Sanyo Electric Co., Ltd. 4'<0, t.

Claims (1)

[Claims] (1) Glue two copper foils together using a thermosetting finger to form a film on both sides of gold deer foil, and then roughen at least one of the copper foils to form the desired conductive pattern. Characteristic Film Substrate Structure (2) A film substrate structure according to claim 1, characterized in that the conductive patterns are formed at regular intervals. {3} Claim 1: A film substrate structure characterized in that the other copper foil is etched to form a fixed pattern of metal pieces. (4) A film substrate structure according to claim 1, C2, characterized in that one copper foil on the other is etched to form a conductive path for multilayer wiring.