JPS5885539A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS5885539A
JPS5885539A JP56183768A JP18376881A JPS5885539A JP S5885539 A JPS5885539 A JP S5885539A JP 56183768 A JP56183768 A JP 56183768A JP 18376881 A JP18376881 A JP 18376881A JP S5885539 A JPS5885539 A JP S5885539A
Authority
JP
Japan
Prior art keywords
jig
resin
liquid resin
electronic component
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56183768A
Other languages
English (en)
Japanese (ja)
Other versions
JPS629215B2 (enFirst
Inventor
Ryuichiro Sakai
酒井　隆一郎
Hideya Kokubu
国分　秀弥
Hideo Kano
鹿野　英男
Akio Nadamura
灘村　昭夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP56183768A priority Critical patent/JPS5885539A/ja
Publication of JPS5885539A publication Critical patent/JPS5885539A/ja
Publication of JPS629215B2 publication Critical patent/JPS629215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56183768A 1981-11-18 1981-11-18 電子部品の製造方法 Granted JPS5885539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56183768A JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56183768A JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5885539A true JPS5885539A (ja) 1983-05-21
JPS629215B2 JPS629215B2 (enFirst) 1987-02-27

Family

ID=16141620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56183768A Granted JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5885539A (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151282A (ja) * 1974-10-31 1976-05-06 Hitachi Ltd Handotaisochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151282A (ja) * 1974-10-31 1976-05-06 Hitachi Ltd Handotaisochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS629215B2 (enFirst) 1987-02-27

Similar Documents

Publication Publication Date Title
KR100320776B1 (ko) 반도체장치의제조방법및수지밀봉장치
US3659821A (en) Structure for plastic encapsulation of semiconductor devices
WO1997031393A1 (en) Method of making an air tight cavity in an assembly package
EP1729373A1 (en) Composite molding and molding process
JPS62198139A (ja) 電力用半導体モジユ−ル及びこのモジユ−ルの製造方法
JPS6136710B2 (enFirst)
JPS5885539A (ja) 電子部品の製造方法
JP3192507B2 (ja) 樹脂シール中空型半導体装置の製造方法
JPS6153798B2 (enFirst)
US5013505A (en) Method of molding a casing on a rotary electric component
JPH05138691A (ja) 液状樹脂射出成形金型
JPS6258655B2 (enFirst)
JPS63248211A (ja) 電子部品およびその製造方法
US6302673B1 (en) Integrated circuit chip mold seal
JP2782371B2 (ja) モールドコイルの製造方法および製造金型
JPH1075147A (ja) 圧電部品のパッケージとその製造方法
JPS612348A (ja) 樹脂封止形半導体装置の製造方法
JPH03167913A (ja) 封止基板及び電子部品の製造方法
JP2514818B2 (ja) 集積回路基板の樹脂封止方法
JPH04319415A (ja) 内装品を封入した成形品の製造方法
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JP3156723B2 (ja) 固体電解コンデンサの製造方法
JPS62169428A (ja) 封止方法
JPS63140554A (ja) 混成集積回路およびその製造方法
JPS5992533A (ja) 樹脂封止形半導体装置の製造方法