JPS5879728A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS5879728A
JPS5879728A JP56177737A JP17773781A JPS5879728A JP S5879728 A JPS5879728 A JP S5879728A JP 56177737 A JP56177737 A JP 56177737A JP 17773781 A JP17773781 A JP 17773781A JP S5879728 A JPS5879728 A JP S5879728A
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
cut
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56177737A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366423B2 (enrdf_load_stackoverflow
Inventor
Takeshi Hasegawa
猛 長谷川
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56177737A priority Critical patent/JPS5879728A/ja
Publication of JPS5879728A publication Critical patent/JPS5879728A/ja
Publication of JPS6366423B2 publication Critical patent/JPS6366423B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56177737A 1981-11-05 1981-11-05 ワイヤボンデイング方法 Granted JPS5879728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5879728A true JPS5879728A (ja) 1983-05-13
JPS6366423B2 JPS6366423B2 (enrdf_load_stackoverflow) 1988-12-20

Family

ID=16036238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177737A Granted JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5879728A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489359B2 (en) 2003-02-20 2009-02-10 Sony Corporation Lens adapter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681947A (en) * 1979-11-10 1981-07-04 Shinkawa Ltd Ultrasonic wave wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681947A (en) * 1979-11-10 1981-07-04 Shinkawa Ltd Ultrasonic wave wire bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489359B2 (en) 2003-02-20 2009-02-10 Sony Corporation Lens adapter

Also Published As

Publication number Publication date
JPS6366423B2 (enrdf_load_stackoverflow) 1988-12-20

Similar Documents

Publication Publication Date Title
JPS5950536A (ja) ワイヤボンデイング装置
US5981371A (en) Bump forming method
GB1153002A (en) Vibratory Bonding methods and apparatus
JPS5879728A (ja) ワイヤボンデイング方法
JPS6256659B2 (enrdf_load_stackoverflow)
JP7542895B1 (ja) ワイヤボンディング装置
JP2575066B2 (ja) 半導体組立装置
TWI901206B (zh) 打線接合裝置
JPS5951742B2 (ja) 超音波ワイヤボンデイング方法
JP3478510B2 (ja) ワイヤボンディング装置
JPH02273952A (ja) キヤピラリへのワイヤ通し方法
JPS60132333A (ja) ワイヤボンデイング装置
JPH09191023A (ja) ワイヤボンディング装置
JPS62140428A (ja) ワイヤボンデイング方法
JPS5919463B2 (ja) ワイヤボンデイング方法
JPS6298629A (ja) ワイヤボンデイング方法
JPH10256320A (ja) 半導体製造装置
JPS6158977B2 (enrdf_load_stackoverflow)
JPS6122641A (ja) 超音波加工装置
JP2565009B2 (ja) ワイヤボンディング方法
JPS6081835A (ja) 自動ボンデイングワイヤ−通し機構
JPS6035526A (ja) ワイヤボンディング方法
JPS63136536A (ja) ワイヤボンデイング方法
JPS5936939A (ja) ワイヤボンダ
JPH08191087A (ja) ワイヤボンディング方法及びワイヤボンディング装置