JPS5878638U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5878638U JPS5878638U JP1981174354U JP17435481U JPS5878638U JP S5878638 U JPS5878638 U JP S5878638U JP 1981174354 U JP1981174354 U JP 1981174354U JP 17435481 U JP17435481 U JP 17435481U JP S5878638 U JPS5878638 U JP S5878638U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip fixing
- lead
- semiconductor device
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981174354U JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981174354U JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5878638U true JPS5878638U (ja) | 1983-05-27 |
| JPS6339970Y2 JPS6339970Y2 (enExample) | 1988-10-19 |
Family
ID=29966331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981174354U Granted JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878638U (enExample) |
-
1981
- 1981-11-24 JP JP1981174354U patent/JPS5878638U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6339970Y2 (enExample) | 1988-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5878638U (ja) | 半導体装置 | |
| JPS58122457U (ja) | 半導体装置 | |
| JPS585309U (ja) | 超電導コイル | |
| JPS5980972U (ja) | 電気的接合部材の取付構造 | |
| JPS6071146U (ja) | 半導体装置 | |
| JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
| JPS6063965U (ja) | 印刷配線基板 | |
| JPS5983049U (ja) | 微小半導体装置 | |
| JPS59112954U (ja) | 絶縁物封止半導体装置 | |
| JPS60190186U (ja) | 連鎖接続型整流器 | |
| JPS5844769U (ja) | 接触子 | |
| JPS5939873U (ja) | 端子盤 | |
| JPS59189979U (ja) | リ−ド線止め具 | |
| JPS6115748U (ja) | 半導体装置 | |
| JPS59132650U (ja) | 樹脂封止型電子部品 | |
| JPS60129137U (ja) | 樹脂モ−ルド型半導体装置 | |
| JPS5868082U (ja) | 配線保持装置 | |
| JPS58160470U (ja) | 給電装置 | |
| JPS605136U (ja) | 半導体装置 | |
| JPS59190877U (ja) | 断熱材 | |
| JPS58176377U (ja) | 端子台 | |
| JPS61251U (ja) | 電子部品 | |
| JPS5877084U (ja) | 回路基板 | |
| JPS59123347U (ja) | 混成集積回路装置 | |
| JPS6071145U (ja) | 半導体装置 |