JPS5875861A - 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 - Google Patents

回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Info

Publication number
JPS5875861A
JPS5875861A JP56173749A JP17374981A JPS5875861A JP S5875861 A JPS5875861 A JP S5875861A JP 56173749 A JP56173749 A JP 56173749A JP 17374981 A JP17374981 A JP 17374981A JP S5875861 A JPS5875861 A JP S5875861A
Authority
JP
Japan
Prior art keywords
lead
alloy
lead wire
circuit element
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56173749A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6251500B2 (cs
Inventor
Katsumi Ishii
勝美 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denka Inc
Original Assignee
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denka Inc filed Critical Fuji Denka Inc
Priority to JP56173749A priority Critical patent/JPS5875861A/ja
Publication of JPS5875861A publication Critical patent/JPS5875861A/ja
Publication of JPS6251500B2 publication Critical patent/JPS6251500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56173749A 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 Granted JPS5875861A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56173749A JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56173749A JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Publications (2)

Publication Number Publication Date
JPS5875861A true JPS5875861A (ja) 1983-05-07
JPS6251500B2 JPS6251500B2 (cs) 1987-10-30

Family

ID=15966413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56173749A Granted JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Country Status (1)

Country Link
JP (1) JPS5875861A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603144A (ja) * 1983-06-21 1985-01-09 Oki Electric Ind Co Ltd 半導体パツケ−ジのリ−ド処理方法
JPH0235762A (ja) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd 半導体パッケージの端子ピン
JPH0235763A (ja) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd 端子ピン付き基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439598U (cs) * 1987-08-31 1989-03-09

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036954A (cs) * 1973-06-22 1975-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036954A (cs) * 1973-06-22 1975-04-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603144A (ja) * 1983-06-21 1985-01-09 Oki Electric Ind Co Ltd 半導体パツケ−ジのリ−ド処理方法
JPH0235762A (ja) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd 半導体パッケージの端子ピン
JPH0235763A (ja) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd 端子ピン付き基板

Also Published As

Publication number Publication date
JPS6251500B2 (cs) 1987-10-30

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