JPS5874351A - 銅蒸着ポリエステルフイルム - Google Patents

銅蒸着ポリエステルフイルム

Info

Publication number
JPS5874351A
JPS5874351A JP17309781A JP17309781A JPS5874351A JP S5874351 A JPS5874351 A JP S5874351A JP 17309781 A JP17309781 A JP 17309781A JP 17309781 A JP17309781 A JP 17309781A JP S5874351 A JPS5874351 A JP S5874351A
Authority
JP
Japan
Prior art keywords
polyester film
copper
film
thickness
copper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17309781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6116620B2 (enExample
Inventor
市川　容圓
忠己 松山
克彦 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP17309781A priority Critical patent/JPS5874351A/ja
Publication of JPS5874351A publication Critical patent/JPS5874351A/ja
Publication of JPS6116620B2 publication Critical patent/JPS6116620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition

Landscapes

  • Laminated Bodies (AREA)
JP17309781A 1981-10-30 1981-10-30 銅蒸着ポリエステルフイルム Granted JPS5874351A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17309781A JPS5874351A (ja) 1981-10-30 1981-10-30 銅蒸着ポリエステルフイルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17309781A JPS5874351A (ja) 1981-10-30 1981-10-30 銅蒸着ポリエステルフイルム

Publications (2)

Publication Number Publication Date
JPS5874351A true JPS5874351A (ja) 1983-05-04
JPS6116620B2 JPS6116620B2 (enExample) 1986-05-01

Family

ID=15954129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17309781A Granted JPS5874351A (ja) 1981-10-30 1981-10-30 銅蒸着ポリエステルフイルム

Country Status (1)

Country Link
JP (1) JPS5874351A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US8456001B2 (en) 2006-09-26 2013-06-04 Mitsubishi Electric Corporation Pressure-contact semiconductor device
CN107107554A (zh) * 2015-01-10 2017-08-29 三菱化学株式会社 双面金属叠层膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146372A (en) * 1974-10-17 1976-04-20 Teijin Ltd Goseijushifuirumuno shikannetsushorihoho
JPS51101735A (ja) * 1975-03-06 1976-09-08 Sumitomo Bakelite Co Kinzokuhakumakuhifukunetsukasoseijushifuirumunoseizohoho
JPS5396072A (en) * 1977-02-02 1978-08-22 Teijin Ltd Preparation of polyester film with excellent dimensional stability

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146372A (en) * 1974-10-17 1976-04-20 Teijin Ltd Goseijushifuirumuno shikannetsushorihoho
JPS51101735A (ja) * 1975-03-06 1976-09-08 Sumitomo Bakelite Co Kinzokuhakumakuhifukunetsukasoseijushifuirumunoseizohoho
JPS5396072A (en) * 1977-02-02 1978-08-22 Teijin Ltd Preparation of polyester film with excellent dimensional stability

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US8456001B2 (en) 2006-09-26 2013-06-04 Mitsubishi Electric Corporation Pressure-contact semiconductor device
CN107107554A (zh) * 2015-01-10 2017-08-29 三菱化学株式会社 双面金属叠层膜
CN107107554B (zh) * 2015-01-10 2020-04-03 三菱化学株式会社 双面金属叠层膜

Also Published As

Publication number Publication date
JPS6116620B2 (enExample) 1986-05-01

Similar Documents

Publication Publication Date Title
JP3570802B2 (ja) 銅薄膜基板及びプリント配線板
JPS59175785A (ja) 配線基板
EP0786928A1 (en) Novel flexible copper-coated laminate and flexible printed circuit board
WO1996038029A1 (en) Flexible printed wiring board
CN113421697B (zh) 一种柔性覆铜膜及其制造方法
US4068022A (en) Methods of strengthening bonds
JPH0298994A (ja) ポリイミド絶縁層上への導体層形成方法
JPS5874351A (ja) 銅蒸着ポリエステルフイルム
CN102792786B (zh) 2层挠性基板及其制造方法
JP3265027B2 (ja) 金属膜付きポリイミドフィルム
JP3305770B2 (ja) 金属膜付きポリイミドフィルム
JPH03209792A (ja) 両面金属張りフレキシブル印刷配線基板およびその製造方法
JPH04267597A (ja) フレキシブルプリント配線板の製造方法
JPS6255991A (ja) シ−ルド付可撓性プリント回路基板
JPH01321687A (ja) フレキシブルプリント配線用基板
JPH03155933A (ja) 積層体
JPS61177792A (ja) フレキシブルプリント基板の製造方法
JPH02251435A (ja) フレキシブル配線板
JPH01214096A (ja) フレキシブルプリント回路基板の製造方法
JPH1110776A (ja) 回路用積層体
JP2862721B2 (ja) プリント基板
JPS63303730A (ja) 金属薄膜蒸着ポリエ−テルイミドフィルム
JPS6247908A (ja) 導電性フイルム
JP3059869B2 (ja) プリント配線基板用基材
JPS61252160A (ja) フレキシブル電気回路配線用基板およびその製造方法