JPS586142A - 混成集積回路の封止方法 - Google Patents

混成集積回路の封止方法

Info

Publication number
JPS586142A
JPS586142A JP56104811A JP10481181A JPS586142A JP S586142 A JPS586142 A JP S586142A JP 56104811 A JP56104811 A JP 56104811A JP 10481181 A JP10481181 A JP 10481181A JP S586142 A JPS586142 A JP S586142A
Authority
JP
Japan
Prior art keywords
resin
screen
epoxy resin
whole
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56104811A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142415B2 (2
Inventor
Akira Kazami
風見　明
Takeo Kondo
近藤　武雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP56104811A priority Critical patent/JPS586142A/ja
Publication of JPS586142A publication Critical patent/JPS586142A/ja
Publication of JPS6142415B2 publication Critical patent/JPS6142415B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56104811A 1981-07-03 1981-07-03 混成集積回路の封止方法 Granted JPS586142A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56104811A JPS586142A (ja) 1981-07-03 1981-07-03 混成集積回路の封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56104811A JPS586142A (ja) 1981-07-03 1981-07-03 混成集積回路の封止方法

Publications (2)

Publication Number Publication Date
JPS586142A true JPS586142A (ja) 1983-01-13
JPS6142415B2 JPS6142415B2 (2) 1986-09-20

Family

ID=14390793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56104811A Granted JPS586142A (ja) 1981-07-03 1981-07-03 混成集積回路の封止方法

Country Status (1)

Country Link
JP (1) JPS586142A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0322588A (ja) * 1989-06-20 1991-01-30 Mitsubishi Materials Corp ピンレスグリッドアレイ型多層混成集積回路
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
EP0890988A3 (de) * 1997-07-11 1999-12-08 Alcatel In einem Gehäuse angeordnete elektrische Schaltungsanordnung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114045A (en) * 1974-07-25 1976-02-04 Mitsui Shipbuilding Eng Kaitentaino kaitentanichichokusetsushijisochi
JPS5472463A (en) * 1977-11-22 1979-06-09 Fujitsu Ltd Method of trimming function of hybrid integrated circuit
JPS5588359A (en) * 1978-12-27 1980-07-04 Fujitsu Ltd Hybrid ic package
JPS5650546A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114045A (en) * 1974-07-25 1976-02-04 Mitsui Shipbuilding Eng Kaitentaino kaitentanichichokusetsushijisochi
JPS5472463A (en) * 1977-11-22 1979-06-09 Fujitsu Ltd Method of trimming function of hybrid integrated circuit
JPS5588359A (en) * 1978-12-27 1980-07-04 Fujitsu Ltd Hybrid ic package
JPS5650546A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
JPH0322588A (ja) * 1989-06-20 1991-01-30 Mitsubishi Materials Corp ピンレスグリッドアレイ型多層混成集積回路
EP0890988A3 (de) * 1997-07-11 1999-12-08 Alcatel In einem Gehäuse angeordnete elektrische Schaltungsanordnung
US6157544A (en) * 1997-07-11 2000-12-05 Alcatel Electrical circuit configuration arranged in a casing

Also Published As

Publication number Publication date
JPS6142415B2 (2) 1986-09-20

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