JPS5588359A - Hybrid ic package - Google Patents
Hybrid ic packageInfo
- Publication number
- JPS5588359A JPS5588359A JP16004178A JP16004178A JPS5588359A JP S5588359 A JPS5588359 A JP S5588359A JP 16004178 A JP16004178 A JP 16004178A JP 16004178 A JP16004178 A JP 16004178A JP S5588359 A JPS5588359 A JP S5588359A
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- enclosing
- resin
- enclosing material
- semiflexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
PURPOSE: To prevent peeling and crack of an enclosing material by providing a semiflexible resin intermediate material by dipping and a lid type resin enclosing material by powder coating in sequence on the outer periphery of a hybrid IC.
CONSTITUTION: A passive element 2 is placed on a ceramic substrate 1 to constitute a hybrid IC, and a semiflexible epoxy risin is applied thinly on its outer periphery through dipping to form an intermediate material 5. Then, a lid type resin like epoxy or phenol resin is applied to the outer periphery of the intermediate material 5 through powder coating to form an enclosing material 6. The semiflexible resin is superior in adhesive property for hybrid IC and lid type resin as well, therefore the enclosing material can be prevented from peeling by the constitution described above. Further, the enclosing material can be prevented from crack also by relieving a difference in the coefficient of linear expansion between enclosing material and IC and a strain of shrinkage of the enclosing material during curing with the intermediate material.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16004178A JPS5588359A (en) | 1978-12-27 | 1978-12-27 | Hybrid ic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16004178A JPS5588359A (en) | 1978-12-27 | 1978-12-27 | Hybrid ic package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5588359A true JPS5588359A (en) | 1980-07-04 |
Family
ID=15706644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16004178A Pending JPS5588359A (en) | 1978-12-27 | 1978-12-27 | Hybrid ic package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5588359A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586142A (en) * | 1981-07-03 | 1983-01-13 | Sanyo Electric Co Ltd | Sealing method for hybrid integrated circuit |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124864B1 (en) * | 1970-06-29 | 1976-07-27 | ||
JPS5410703A (en) * | 1977-06-27 | 1979-01-26 | Hokushin Electric Works | Magnetic recording medium |
-
1978
- 1978-12-27 JP JP16004178A patent/JPS5588359A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124864B1 (en) * | 1970-06-29 | 1976-07-27 | ||
JPS5410703A (en) * | 1977-06-27 | 1979-01-26 | Hokushin Electric Works | Magnetic recording medium |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586142A (en) * | 1981-07-03 | 1983-01-13 | Sanyo Electric Co Ltd | Sealing method for hybrid integrated circuit |
JPS6142415B2 (en) * | 1981-07-03 | 1986-09-20 | Sanyo Denki Kk |
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