JPS5588359A - Hybrid ic package - Google Patents

Hybrid ic package

Info

Publication number
JPS5588359A
JPS5588359A JP16004178A JP16004178A JPS5588359A JP S5588359 A JPS5588359 A JP S5588359A JP 16004178 A JP16004178 A JP 16004178A JP 16004178 A JP16004178 A JP 16004178A JP S5588359 A JPS5588359 A JP S5588359A
Authority
JP
Japan
Prior art keywords
hybrid
enclosing
resin
enclosing material
semiflexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16004178A
Other languages
Japanese (ja)
Inventor
Ryoichi Ozaki
Hiroaki Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16004178A priority Critical patent/JPS5588359A/en
Publication of JPS5588359A publication Critical patent/JPS5588359A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE: To prevent peeling and crack of an enclosing material by providing a semiflexible resin intermediate material by dipping and a lid type resin enclosing material by powder coating in sequence on the outer periphery of a hybrid IC.
CONSTITUTION: A passive element 2 is placed on a ceramic substrate 1 to constitute a hybrid IC, and a semiflexible epoxy risin is applied thinly on its outer periphery through dipping to form an intermediate material 5. Then, a lid type resin like epoxy or phenol resin is applied to the outer periphery of the intermediate material 5 through powder coating to form an enclosing material 6. The semiflexible resin is superior in adhesive property for hybrid IC and lid type resin as well, therefore the enclosing material can be prevented from peeling by the constitution described above. Further, the enclosing material can be prevented from crack also by relieving a difference in the coefficient of linear expansion between enclosing material and IC and a strain of shrinkage of the enclosing material during curing with the intermediate material.
COPYRIGHT: (C)1980,JPO&Japio
JP16004178A 1978-12-27 1978-12-27 Hybrid ic package Pending JPS5588359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16004178A JPS5588359A (en) 1978-12-27 1978-12-27 Hybrid ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16004178A JPS5588359A (en) 1978-12-27 1978-12-27 Hybrid ic package

Publications (1)

Publication Number Publication Date
JPS5588359A true JPS5588359A (en) 1980-07-04

Family

ID=15706644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16004178A Pending JPS5588359A (en) 1978-12-27 1978-12-27 Hybrid ic package

Country Status (1)

Country Link
JP (1) JPS5588359A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586142A (en) * 1981-07-03 1983-01-13 Sanyo Electric Co Ltd Sealing method for hybrid integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124864B1 (en) * 1970-06-29 1976-07-27
JPS5410703A (en) * 1977-06-27 1979-01-26 Hokushin Electric Works Magnetic recording medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124864B1 (en) * 1970-06-29 1976-07-27
JPS5410703A (en) * 1977-06-27 1979-01-26 Hokushin Electric Works Magnetic recording medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586142A (en) * 1981-07-03 1983-01-13 Sanyo Electric Co Ltd Sealing method for hybrid integrated circuit
JPS6142415B2 (en) * 1981-07-03 1986-09-20 Sanyo Denki Kk

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