JPS5471573A - Resin package method of electronic parts - Google Patents

Resin package method of electronic parts

Info

Publication number
JPS5471573A
JPS5471573A JP13854777A JP13854777A JPS5471573A JP S5471573 A JPS5471573 A JP S5471573A JP 13854777 A JP13854777 A JP 13854777A JP 13854777 A JP13854777 A JP 13854777A JP S5471573 A JPS5471573 A JP S5471573A
Authority
JP
Japan
Prior art keywords
glass transition
transition temperature
electronic parts
stresses
coating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13854777A
Other languages
Japanese (ja)
Inventor
Akinobu Tamaoki
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13854777A priority Critical patent/JPS5471573A/en
Publication of JPS5471573A publication Critical patent/JPS5471573A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To perform resin sealing with powder coating of a low glass transition temperature as a lower layer and powder coating of a high glass transition temperature as an upper layer.
CONSTITUTION: Thermosetting polyurethane, polyester, epoxy powder, etc. are used and those of glass transition temperatures O up to 200°C are used. Inorganic fillers can be contained. The resin having heat-set at the glass transition temperature hardens like glass from rubber form. As the temperature is lower than the glass transition temperature, stresses increase with electronic parts, thus causing cracking and characteristic defects. Thereupon, a coating film of a low glass transition temperature is provided near the electronic parts to reduce the stresses and a coating film of a high glass transition tempeture is externally provided to protect against the de formation and breakdown caused by the impact from the outside and provide good water-resistant performance. These are then tightened by the stresses being generated, whereby the adhesion of lead wires, etc. is improved.
COPYRIGHT: (C)1979,JPO&Japio
JP13854777A 1977-11-17 1977-11-17 Resin package method of electronic parts Pending JPS5471573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13854777A JPS5471573A (en) 1977-11-17 1977-11-17 Resin package method of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13854777A JPS5471573A (en) 1977-11-17 1977-11-17 Resin package method of electronic parts

Publications (1)

Publication Number Publication Date
JPS5471573A true JPS5471573A (en) 1979-06-08

Family

ID=15224693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13854777A Pending JPS5471573A (en) 1977-11-17 1977-11-17 Resin package method of electronic parts

Country Status (1)

Country Link
JP (1) JPS5471573A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01209677A (en) * 1988-02-17 1989-08-23 Canon Inc Unitary resin-formed connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01209677A (en) * 1988-02-17 1989-08-23 Canon Inc Unitary resin-formed connector

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