JPS5471573A - Resin package method of electronic parts - Google Patents
Resin package method of electronic partsInfo
- Publication number
- JPS5471573A JPS5471573A JP13854777A JP13854777A JPS5471573A JP S5471573 A JPS5471573 A JP S5471573A JP 13854777 A JP13854777 A JP 13854777A JP 13854777 A JP13854777 A JP 13854777A JP S5471573 A JPS5471573 A JP S5471573A
- Authority
- JP
- Japan
- Prior art keywords
- glass transition
- transition temperature
- electronic parts
- stresses
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To perform resin sealing with powder coating of a low glass transition temperature as a lower layer and powder coating of a high glass transition temperature as an upper layer.
CONSTITUTION: Thermosetting polyurethane, polyester, epoxy powder, etc. are used and those of glass transition temperatures O up to 200°C are used. Inorganic fillers can be contained. The resin having heat-set at the glass transition temperature hardens like glass from rubber form. As the temperature is lower than the glass transition temperature, stresses increase with electronic parts, thus causing cracking and characteristic defects. Thereupon, a coating film of a low glass transition temperature is provided near the electronic parts to reduce the stresses and a coating film of a high glass transition tempeture is externally provided to protect against the de formation and breakdown caused by the impact from the outside and provide good water-resistant performance. These are then tightened by the stresses being generated, whereby the adhesion of lead wires, etc. is improved.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13854777A JPS5471573A (en) | 1977-11-17 | 1977-11-17 | Resin package method of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13854777A JPS5471573A (en) | 1977-11-17 | 1977-11-17 | Resin package method of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5471573A true JPS5471573A (en) | 1979-06-08 |
Family
ID=15224693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13854777A Pending JPS5471573A (en) | 1977-11-17 | 1977-11-17 | Resin package method of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5471573A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01209677A (en) * | 1988-02-17 | 1989-08-23 | Canon Inc | Unitary resin-formed connector |
-
1977
- 1977-11-17 JP JP13854777A patent/JPS5471573A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01209677A (en) * | 1988-02-17 | 1989-08-23 | Canon Inc | Unitary resin-formed connector |
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