JPS5860541A - ウエハの加工方法 - Google Patents

ウエハの加工方法

Info

Publication number
JPS5860541A
JPS5860541A JP56159812A JP15981281A JPS5860541A JP S5860541 A JPS5860541 A JP S5860541A JP 56159812 A JP56159812 A JP 56159812A JP 15981281 A JP15981281 A JP 15981281A JP S5860541 A JPS5860541 A JP S5860541A
Authority
JP
Japan
Prior art keywords
wafer
wax
parallel
vacuum chuck
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56159812A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332212B2 (en:Method
Inventor
Hiroshi Torii
鳥井　博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP56159812A priority Critical patent/JPS5860541A/ja
Publication of JPS5860541A publication Critical patent/JPS5860541A/ja
Publication of JPH0332212B2 publication Critical patent/JPH0332212B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP56159812A 1981-10-07 1981-10-07 ウエハの加工方法 Granted JPS5860541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56159812A JPS5860541A (ja) 1981-10-07 1981-10-07 ウエハの加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56159812A JPS5860541A (ja) 1981-10-07 1981-10-07 ウエハの加工方法

Publications (2)

Publication Number Publication Date
JPS5860541A true JPS5860541A (ja) 1983-04-11
JPH0332212B2 JPH0332212B2 (en:Method) 1991-05-10

Family

ID=15701785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56159812A Granted JPS5860541A (ja) 1981-10-07 1981-10-07 ウエハの加工方法

Country Status (1)

Country Link
JP (1) JPS5860541A (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263437A (ja) * 1989-04-03 1990-10-26 Mitsubishi Electric Corp ウエハ剥し装置
JP2011025338A (ja) * 2009-07-23 2011-02-10 Disco Abrasive Syst Ltd 板状物固定方法
JP2012049448A (ja) * 2010-08-30 2012-03-08 Mitsubishi Chemicals Corp 窒化物半導体基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164535A (en) * 1980-05-23 1981-12-17 Toshiba Corp Manufacture of semicondutor element
JPS57147241A (en) * 1981-03-05 1982-09-11 Nec Corp Bonding method for crystal wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164535A (en) * 1980-05-23 1981-12-17 Toshiba Corp Manufacture of semicondutor element
JPS57147241A (en) * 1981-03-05 1982-09-11 Nec Corp Bonding method for crystal wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263437A (ja) * 1989-04-03 1990-10-26 Mitsubishi Electric Corp ウエハ剥し装置
JP2011025338A (ja) * 2009-07-23 2011-02-10 Disco Abrasive Syst Ltd 板状物固定方法
JP2012049448A (ja) * 2010-08-30 2012-03-08 Mitsubishi Chemicals Corp 窒化物半導体基板の製造方法

Also Published As

Publication number Publication date
JPH0332212B2 (en:Method) 1991-05-10

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