JPS5858295A - 導電性基材の製造方法 - Google Patents
導電性基材の製造方法Info
- Publication number
- JPS5858295A JPS5858295A JP15546181A JP15546181A JPS5858295A JP S5858295 A JPS5858295 A JP S5858295A JP 15546181 A JP15546181 A JP 15546181A JP 15546181 A JP15546181 A JP 15546181A JP S5858295 A JPS5858295 A JP S5858295A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- substrate
- silver plating
- citric acid
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 47
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 38
- 239000004332 silver Substances 0.000 title claims abstract description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 47
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 7
- 150000002344 gold compounds Chemical class 0.000 claims abstract description 7
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 19
- 239000002585 base Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 16
- -1 alkali metal citrate salt Chemical class 0.000 claims description 6
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000011282 treatment Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000002203 pretreatment Methods 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15546181A JPS5858295A (ja) | 1981-09-30 | 1981-09-30 | 導電性基材の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15546181A JPS5858295A (ja) | 1981-09-30 | 1981-09-30 | 導電性基材の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5858295A true JPS5858295A (ja) | 1983-04-06 |
| JPH0121233B2 JPH0121233B2 (enExample) | 1989-04-20 |
Family
ID=15606552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15546181A Granted JPS5858295A (ja) | 1981-09-30 | 1981-09-30 | 導電性基材の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858295A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03107493A (ja) * | 1989-09-20 | 1991-05-07 | Nippon Mining Co Ltd | 銀めっきの前処理液 |
| JPH03146695A (ja) * | 1989-11-01 | 1991-06-21 | Nippon Mining Co Ltd | 銀めっきの前処理液の浄化方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852497A (ja) * | 1981-09-22 | 1983-03-28 | Electroplating Eng Of Japan Co | ニツケル又はニツケル合金の銀めつき方法 |
-
1981
- 1981-09-30 JP JP15546181A patent/JPS5858295A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852497A (ja) * | 1981-09-22 | 1983-03-28 | Electroplating Eng Of Japan Co | ニツケル又はニツケル合金の銀めつき方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03107493A (ja) * | 1989-09-20 | 1991-05-07 | Nippon Mining Co Ltd | 銀めっきの前処理液 |
| JPH03146695A (ja) * | 1989-11-01 | 1991-06-21 | Nippon Mining Co Ltd | 銀めっきの前処理液の浄化方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0121233B2 (enExample) | 1989-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3489657A (en) | Process for producing solderable aluminum materials | |
| JP2553574B2 (ja) | 銀剥離液 | |
| JPH0587598B2 (enExample) | ||
| JPS5858295A (ja) | 導電性基材の製造方法 | |
| JPH0119000B2 (enExample) | ||
| US2791553A (en) | Method of electroplating aluminum | |
| JPH0730458B2 (ja) | 亜鉛又は亜鉛系めっき材料の黒色化処理方法 | |
| US2966448A (en) | Methods of electroplating aluminum and alloys thereof | |
| JPS6196088A (ja) | Ｎｉ−Ｆｅ合金ＩＣ用リ−ドフレ−ムの製造法 | |
| JPH024979A (ja) | 金属の錫メッキ方法およびメッキ液 | |
| JP3074369B2 (ja) | 金合金メッキ液 | |
| JPH0459975A (ja) | 電子部品の銀メッキ方法 | |
| JPS6340864B2 (enExample) | ||
| JPS5852497A (ja) | ニツケル又はニツケル合金の銀めつき方法 | |
| JP3685276B2 (ja) | パラジウム・銀合金めっき浴 | |
| JPH02145792A (ja) | 耐熱剥離性に優れた錫またははんだめっき被覆銅または銅合金材料 | |
| SU398704A1 (ru) | Раствор для предварительной подготовки | |
| JPS61136699A (ja) | リ−ドフレ−ムのメツキ方法 | |
| JPH0210237B2 (enExample) | ||
| JPS6160152B2 (enExample) | ||
| SU138787A1 (ru) | Способ гальванического серебрени алюмини и его сплавов | |
| JPH0151559B2 (enExample) | ||
| JPS60190592A (ja) | 銀メツキの前処理液 | |
| JPS60190589A (ja) | 銀めつき前処理液 | |
| JPS5914557B2 (ja) | メツキ方法 |