JPS5855652Y2 - 光半導体装置 - Google Patents

光半導体装置

Info

Publication number
JPS5855652Y2
JPS5855652Y2 JP1977029602U JP2960277U JPS5855652Y2 JP S5855652 Y2 JPS5855652 Y2 JP S5855652Y2 JP 1977029602 U JP1977029602 U JP 1977029602U JP 2960277 U JP2960277 U JP 2960277U JP S5855652 Y2 JPS5855652 Y2 JP S5855652Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
envelope
light
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977029602U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53124654U (enExample
Inventor
裕 永沢
俊博 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1977029602U priority Critical patent/JPS5855652Y2/ja
Publication of JPS53124654U publication Critical patent/JPS53124654U/ja
Application granted granted Critical
Publication of JPS5855652Y2 publication Critical patent/JPS5855652Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977029602U 1977-03-14 1977-03-14 光半導体装置 Expired JPS5855652Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977029602U JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977029602U JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Publications (2)

Publication Number Publication Date
JPS53124654U JPS53124654U (enExample) 1978-10-04
JPS5855652Y2 true JPS5855652Y2 (ja) 1983-12-20

Family

ID=28877679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977029602U Expired JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Country Status (1)

Country Link
JP (1) JPS5855652Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2553342Y2 (ja) * 1989-12-08 1997-11-05 シャープ株式会社 発光ダイオードランプ

Also Published As

Publication number Publication date
JPS53124654U (enExample) 1978-10-04

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