JPS53124654U - - Google Patents
Info
- Publication number
- JPS53124654U JPS53124654U JP1977029602U JP2960277U JPS53124654U JP S53124654 U JPS53124654 U JP S53124654U JP 1977029602 U JP1977029602 U JP 1977029602U JP 2960277 U JP2960277 U JP 2960277U JP S53124654 U JPS53124654 U JP S53124654U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029602U JPS5855652Y2 (ja) | 1977-03-14 | 1977-03-14 | 光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977029602U JPS5855652Y2 (ja) | 1977-03-14 | 1977-03-14 | 光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53124654U true JPS53124654U (enExample) | 1978-10-04 |
| JPS5855652Y2 JPS5855652Y2 (ja) | 1983-12-20 |
Family
ID=28877679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977029602U Expired JPS5855652Y2 (ja) | 1977-03-14 | 1977-03-14 | 光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855652Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381652U (enExample) * | 1989-12-08 | 1991-08-21 |
-
1977
- 1977-03-14 JP JP1977029602U patent/JPS5855652Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381652U (enExample) * | 1989-12-08 | 1991-08-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5855652Y2 (ja) | 1983-12-20 |