JPS5855601Y2 - モ−ルド電子部品 - Google Patents
モ−ルド電子部品Info
- Publication number
- JPS5855601Y2 JPS5855601Y2 JP9391477U JP9391477U JPS5855601Y2 JP S5855601 Y2 JPS5855601 Y2 JP S5855601Y2 JP 9391477 U JP9391477 U JP 9391477U JP 9391477 U JP9391477 U JP 9391477U JP S5855601 Y2 JPS5855601 Y2 JP S5855601Y2
- Authority
- JP
- Japan
- Prior art keywords
- molded
- resin
- molded electronic
- electronic parts
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391477U JPS5855601Y2 (ja) | 1977-07-13 | 1977-07-13 | モ−ルド電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391477U JPS5855601Y2 (ja) | 1977-07-13 | 1977-07-13 | モ−ルド電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5420337U JPS5420337U (Direct) | 1979-02-09 |
| JPS5855601Y2 true JPS5855601Y2 (ja) | 1983-12-20 |
Family
ID=29025446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9391477U Expired JPS5855601Y2 (ja) | 1977-07-13 | 1977-07-13 | モ−ルド電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855601Y2 (Direct) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965521U (ja) * | 1982-10-25 | 1984-05-01 | 日立コンデンサ株式会社 | 樹脂外装型コンデンサ |
-
1977
- 1977-07-13 JP JP9391477U patent/JPS5855601Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5420337U (Direct) | 1979-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3175584B2 (ja) | パワー制御装置 | |
| US20110226514A1 (en) | Electronic device and power converter | |
| JPS5855601Y2 (ja) | モ−ルド電子部品 | |
| JP4013577B2 (ja) | コネクタ一体型電子機器 | |
| JPS60113931A (ja) | 半導体装置 | |
| JPS593557Y2 (ja) | チツプ型コンデンサ | |
| JPS62118555A (ja) | 集積回路パツケ−ジ | |
| US7719095B2 (en) | Lead frame and semiconductor device provided with lead frame | |
| JPH054273Y2 (Direct) | ||
| JPH0532998Y2 (Direct) | ||
| JPH0435908B2 (Direct) | ||
| JP2928377B2 (ja) | コンデンサ | |
| JPS6336158B2 (Direct) | ||
| JP2707899B2 (ja) | 混成集積回路装置 | |
| JPS5992535A (ja) | 半導体装置 | |
| JPS5849639Y2 (ja) | 混成集積回路 | |
| JPH02298005A (ja) | 磁性部品 | |
| JPH06196346A (ja) | リード端子を有する電子部品の製造方法 | |
| JP2910324B2 (ja) | プリント基板の製造方法 | |
| JPS63281451A (ja) | 半導体装置 | |
| JPS5891606A (ja) | コイル装置 | |
| JPS609147A (ja) | 混合集積回路 | |
| JPH0582670A (ja) | 半導体装置 | |
| JPH04133490A (ja) | 回路基板装置 | |
| JPS60254790A (ja) | フラツトリ−ド型電子部品パツケ−ジの取付方法 |