JPS5853118A - Method of welding multilayer contact - Google Patents
Method of welding multilayer contactInfo
- Publication number
- JPS5853118A JPS5853118A JP56152626A JP15262681A JPS5853118A JP S5853118 A JPS5853118 A JP S5853118A JP 56152626 A JP56152626 A JP 56152626A JP 15262681 A JP15262681 A JP 15262681A JP S5853118 A JPS5853118 A JP S5853118A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- base material
- multilayer
- hole
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
- Manufacture Of Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
との発明は、例えばリレーやスイッチの接点ば１−や−
子板に多層接点を喧接する方法に関する。[Detailed Description of the Invention] The invention relates to contact points for relays and switches, for example.
This invention relates to a method for connecting multilayer contacts to a daughter board.
従来この種の溶接は、接点を基材に位ｌｌ決めしたのち
、接点及び基材を電極間に挾持し、約１０００〜１５０
０Ａの電流を流すことによって抵に爵級を行っていた。Conventionally, in this type of welding, after positioning the contact point on the base material, the contact point and the base material are sandwiched between electrodes, and the
By passing a current of 0A, it was possible to perform the test.
従って、せいぜい鎮Ａの開閉を行う接点に対し、浴接時
には約１０００〜１５００＾を流すことによって、電流
や電機の加圧力という条件が噛当でないと散り等が生じ
ることによって帳−面か荒れ接触曲損の減少、接触抵抗
の増大となり、接触信頼性か融（なるものである。Therefore, at best, by flowing approximately 1,000 to 1,500 ^ to the contact that opens and closes the valve A, during bath contact, if the conditions of current and pressurizing force of the electric machine are not met, scattering etc. will occur and the book surface will be rough. Contact bending damage decreases, contact resistance increases, and contact reliability deteriorates.
この発明は上記の事↑Ｈ！ｃ′＃目してなされたもので
あり、その目的とするところは接触面を荒らすこと−く
多層接点を浴接して接触信頼性を同上させると共に、散
り等の材料の飛散を防止する多層接点の藩接方法を提供
するにある。This invention is based on the above ↑H! C'#, and its purpose is to improve contact reliability by bath-bonding multilayer contacts without roughening the contact surface, and to prevent materials from scattering such as scattering. It is to provide a method of contacting the domain.
以下この発明の一実施例をリレーに応用した第１図国乃
至第２図に基づいて説明する。１はリン青銅のフープ材
からなる基材であり１例えば０．６−〜０．５■の直径
を有する貫通孔２を形成している。６は多層接点であり
、この実施例ではＣｕＮｉからなる母材６ａに１ねたＡ
ｇ Ｎ ｉからなる中間層３ｂと、この中間層６ｂの
上に重ねて接触抵抗を小さくする艮導電体のＡ ｇ Ａ
ｕからなる接触層６０の三層となっている。そして、
第１図（−）に示す如く基材１を部材ｘ−Ｙにて支持し
たのち部材Ｚによって多１ｍ接点３の母材５ａを貫通孔
２に対応させて基材１に力■′でもって当接させたのち
、貫通孔２１ｋｌより照射したレーザ光ＡによつてＩｊ
１図（ｂ）に示す如く、基材１と母材３ａを溶かして基
材１に憂−接点３を溶接するものである。４はリレーで
あり、この基材１を分断する゛ことによって接点ばね５
としている。６は固定接点板であり基材１を横銅として
レーザ光ＡＫよって多ＪＩｌ＆１点５を溶接している。An embodiment of the present invention will be described below with reference to FIGS. 1 to 2 in which it is applied to a relay. Reference numeral 1 denotes a base material made of a hoop material of phosphor bronze, in which a through hole 2 having a diameter of, for example, 0.6 to 0.5 cm is formed. Reference numeral 6 indicates a multilayer contact, and in this embodiment, one layer of A is applied to the base material 6a made of CuNi.
An intermediate layer 3b made of gNi and a conductive material A g A which is layered on this intermediate layer 6b to reduce contact resistance.
The contact layer 60 consists of three layers. and,
As shown in FIG. 1 (-), after supporting the base material 1 by members After making contact, Ij is irradiated with laser light A from the through hole 21kl.
As shown in FIG. 1(b), a base material 1 and a base material 3a are melted and a contact point 3 is welded to the base material 1. 4 is a relay, and by dividing this base material 1, a contact spring 5 is formed.
It is said that Reference numeral 6 denotes a fixed contact plate, in which the base material 1 is made of horizontal copper and multiple points 5 are welded together using a laser beam AK.
而して、抵抗溶接に歓べ、接触層ｓｏ Ｋ約１０００〜
１’５００ Ａという大電流を流すことなく、レーザ光
Ａの短時間の照射で多層接点５ｔＤ８績が完了するもの
である。Therefore, you can enjoy resistance welding, and the contact layer so K is about 1000 ~
A multilayer contact of 5tD8 is completed by short-time irradiation with laser light A without flowing a large current of 1'500 A.
第３図及び第４図はこの発明の他の実施例を示しｓ ｌ
ｓ図は貫通孔２を二つ形成し、多層接点５を表鼻番こ溶
接できる様にしたものてあり、第４図、溶接ｍ灰を繭く
したものである。3 and 4 show other embodiments of the invention.
Fig. s shows a structure in which two through holes 2 are formed so that a multilayer contact 5 can be welded on the front face, and Fig. 4 shows a structure in which welding ash is cocooned.
この発明は以上説明した如く、基材１に貫通孔２を形成
し、母材３１ ｊｃ艮導電体からなる接触層５ｏを具備
した多層接点５の母材１ｍを基材１の貫通孔２と対応さ
せて基材１に当接したのち、貫通孔２価より照射したレ
ーザ光Ａによって基材１に多層接点３をｔ４ｉ接したか
ら、従来の抵抗溶接の橡に約１０００〜１５００ Ａと
いう大電流を接触ｍ３゜に流すことが廟くなって接触層
５ｏの接触面６ｄか荒れることを防止し、接触信頼性を
同上させると共に１敗り等の発生も無く接点材料が削減
できるものである。また、レーザ光Ａは短時間の照射で
多層接点３の溶接が完了するので、溶接の緑に発生する
脇によって基材１が変形することも少なくなり、部品検
反も同上させることができる多層接点の溶接方法か得ら
れる。As explained above, in this invention, the through hole 2 is formed in the base material 1, and the base material 1m of the multilayer contact 5 having the contact layer 5o made of a conductor is connected to the through hole 2 of the base material 1. After making contact with the base material 1 in a corresponding manner, the multilayer contact 3 was brought into contact with the base material 1 at t4i using the laser beam A irradiated from the through-hole divalent. This prevents the contact surface 6d of the contact layer 5o from becoming rough due to the current flowing through the contact m3°, improves the contact reliability, and reduces the amount of contact material without causing any failures. . In addition, since the laser beam A completes welding of the multilayer contact 3 in a short period of time, the base material 1 is less likely to be deformed by the welding edges, and the multilayer contact point 3 can be inspected for component inspection as well. How to weld contacts can be obtained.
ｊｌ Ｉ Ｅ（Ａ）乃至ｊ８２図はこの発明の一実施例
を示し、第１図（−１は溶接状態を示す縦断面図、第１
図（ｂ）は−新面囚、亀２図は斜視図である。第５図及
び第４図はこの発明の他の実施例を示し、第５図は板断
面１、第４ＷＡは楓断函図である。
１・・・基材、２・・・貫通孔、３・・・多層接点、
３ｍ・・・母材、５ｏ・・・接触ｍ、Ａ・・・レーザ光
。
第２リ
マ３ Ｆ”
笥４文
△jl I E (A) to j82 show one embodiment of the present invention, and Fig. 1 (-1 is a longitudinal cross-sectional view showing the welded state;
Figure (b) is a new figure, and Figure 2 is a perspective view. 5 and 4 show other embodiments of the present invention, FIG. 5 is a plate cross section 1, and 4th WA is a maple cutaway box view. 1... Base material, 2... Through hole, 3... Multilayer contact,
3m...base material, 5o...contact m, A...laser light. 2nd Lima 3 F” 4 sentences △
Claims (1)
接触層を員愉した多層接点の母材を基材の貫通孔と対応
させて基材８ｃ当接したの１１貫通孔側よ゛り照射した
レーザ光によって基材Ｅ１層接点を溶接したことを特徴
とする多層接点の嬉′鎗方薮(1) A through hole is formed in the base material, and the base material of the multilayer contact, which has a contact layer made of a good conductor on the base material, is made to correspond to the through hole in the base material and comes into contact with the base material 8c. The joy of a multilayer contact characterized by welding a base material E1 layer contact with a laser beam irradiated from the hole side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152626A JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56152626A JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2114840A Division JPH03176919A (en) | 1990-04-27 | 1990-04-27 | Welding method of multilayer contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5853118A true JPS5853118A (en) | 1983-03-29 |
| JPH0249835B2 JPH0249835B2 (en) | 1990-10-31 |
Family
ID=15544486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56152626A Granted JPS5853118A (en) | 1981-09-26 | 1981-09-26 | Method of welding multilayer contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853118A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09174268A (en) * | 1995-08-25 | 1997-07-08 | Thomas & Betts Corp <T&B> | Welded joint forming method and device therefor |
| US5961051A (en) * | 1995-10-31 | 1999-10-05 | Toto Ltd. | Shower apparatus |
| JP2007265962A (en) * | 2006-02-28 | 2007-10-11 | Hitachi Ltd | Method of laser welding, manufacturing method of control unit, and vehicular control unit |
| JP2012016741A (en) * | 2010-07-09 | 2012-01-26 | Denso Corp | Laser fillet welding method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493862A (en) * | 1972-05-04 | 1974-01-14 |
-
1981
- 1981-09-26 JP JP56152626A patent/JPS5853118A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493862A (en) * | 1972-05-04 | 1974-01-14 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09174268A (en) * | 1995-08-25 | 1997-07-08 | Thomas & Betts Corp <T&B> | Welded joint forming method and device therefor |
| US5961051A (en) * | 1995-10-31 | 1999-10-05 | Toto Ltd. | Shower apparatus |
| JP2007265962A (en) * | 2006-02-28 | 2007-10-11 | Hitachi Ltd | Method of laser welding, manufacturing method of control unit, and vehicular control unit |
| JP2012016741A (en) * | 2010-07-09 | 2012-01-26 | Denso Corp | Laser fillet welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249835B2 (en) | 1990-10-31 |
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